Packaging Module Development Engineer
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
ORIGINAL EMPLOYER POSTINGS
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73–96 of 803 employer postings
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
US, California, Santa Clara
Pay posted by employer$105,300–$175,210 USD per year
US, Oregon, Hillsboro +3 locations
Pay posted by employer$233,990–$383,460 USD per year
US, California, Folsom
Pay posted by employer$141,910–$200,340 USD per year
US, Oregon, Hillsboro
Pay posted by employer$115,110–$219,550 USD per year
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
US, Oregon, Hillsboro
Pay posted by employer$115,110–$219,550 USD per year
US, Oregon, Hillsboro
Pay posted by employer$99,030–$139,810 USD per year
US, Oregon, Hillsboro
Pay posted by employer$133,800–$188,890 USD per year
Canada, Toronto
Pay posted by employer$155,888–$220,069 CAD per year
Canada, Toronto
Pay posted by employer$114,890–$162,190 CAD per year
US, New Mexico, Albuquerque
Pay posted by employer$76,390–$146,440 USD per year
PRC, Shanghai +2 locations
US, California, Santa Clara +1 location
Pay posted by employer$141,910–$200,340 USD per year
US, California, Folsom +3 locations
Pay posted by employer$220,920–$311,890 USD per year
Malaysia, Kulim
Taiwan, Taipei
Malaysia, Penang +1 location
Malaysia, Penang
US, Oregon, Hillsboro
Pay posted by employer$191,220–$269,950 USD per year
Malaysia, Penang
Malaysia, Penang
US, Oregon, Hillsboro
Pay posted by employer$211,400–$298,440 USD per year
US, Texas, Austin
Pay posted by employer$122,440–$232,190 USD per year