315 matching jobs

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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.

Broadcom

Package Design Engineer

Singapore-Yishun

Full time
Regular

Added Oct 5, 2026

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Broadcom

Network Threat Detection R&D Engineer

California, United States

Full time
Regular

Pay posted by employer$143,800–$230,000 USD per year

Added Oct 5, 2026

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Broadcom

R&D Engineer Mechanical

San Jose, California, United States 2 postings

Full time
Regular

Pay posted by employer$143,800–$230,000 USD per year

Added Oct 5, 2026

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Broadcom

Product Owner - Precision Design System UX/UI

Plano, Texas, United States +1 location

Pay posted by employer$104,100–$166,500 USD per year

Added Oct 5, 2026

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Broadcom

Staff Design Engineer

Bengaluru, Karnataka, India

Full time
Regular

Added Oct 5, 2026

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Broadcom

DSP System Architect

Irvine, California, United States

Full time
Regular

Pay posted by employer$109,700–$175,500 USD per year

Added Oct 5, 2026

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Broadcom

IC Design Engineer

Bengaluru, Karnataka, India

Full time
Regular

Added Oct 5, 2026

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Broadcom

Advanced Package Technology Engineer

Fort Collins, Colorado, United States +1 location

Full time
Regular

Added Oct 5, 2026

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Broadcom

Digital Design Verification Engineer

San Jose, California, United States +1 location

Full time
Regular

Pay posted by employer$101,000–$162,000 USD per year

Added Oct 5, 2026

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Broadcom

Client Services Consultant 4

Florida, United States +1 location

Full time
Regular

Pay posted by employer$90,000–$144,000 USD per year

Added Oct 5, 2026

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Broadcom

Consultant - Datacom

Plano, Texas, United States

Full time
Regular

Pay posted by employer$73,100–$117,000 USD per year

Added Oct 5, 2026

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Broadcom

Administrative Support

California, United States

Full time
Regular

Pay posted by employer$28.41–$39.90 per hour

Added Oct 5, 2026

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Broadcom

Memory Design Engineer

Bengaluru, Karnataka, India

Full time
Regular

Added Oct 5, 2026

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Broadcom

Senior Memory Design Engineer

Bengaluru, Karnataka, India 2 postings

Full time
Regular

Added Oct 5, 2026

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Broadcom

Die-to-Die (D2D) Applications Engineer

Fort Collins, Colorado, United States

Full time
Regular

Pay posted by employer$91,100–$146,000 USD per year

Added Oct 5, 2026

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Broadcom

ASIC Implementation Engineer PD

San Jose, California, United States

Full time
Regular

Pay posted by employer$121,900–$195,000 USD per year

Added Oct 5, 2026

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Broadcom

RF System Engineer

San Jose, California, United States

Full time
Regular

Pay posted by employer$121,900–$195,000 USD per year

Added Oct 5, 2026

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Broadcom

Community & Virtual Events Manager – Mainframe Customer Engagement

Melville, New York, United States +3 locations

Full time
Regular

Pay posted by employer$73,100–$117,000 USD per year

Added Oct 5, 2026

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Broadcom

Sr Mainframe Technical Consultant

Plano, Texas, United States +87 locations

Full time
Regular

Pay posted by employer$100,000–$160,000 USD per year

Added Oct 5, 2026

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Broadcom

R&D Engineer Software 5

Hyderabad, Telangana, India 2 postings

Full time
Regular

Added Oct 5, 2026

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Broadcom

Package Design Engineer

Singapore-Yishun

Full time
Regular

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About this opportunity

Original employer description

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Job Description:

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.
Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.
Schedule, prioritize, & track your work across multiple projects simultaneously
General flip-chip BGA package design & engineering

EDUCATION/EXPERIENCE & REQUIREMENTS:

B.Eng (EE/EEE) or similar field and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes
Knowledge of package-level signal integrity and power integrity, to apply to package designs
Cadence APD (allegro package designer) experience is preferred. Equivalent tools will also be considered.
Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers.
Good organizational and task management skills to manage multiple package design projects.

PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS:

B.Eng (EE/EEE) or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.
M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred.
Experience with 2.5D and 3DIC packages is highly advantageous.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Why this result? · Employer labels

Full time
R&D
Regular

Location reference: GeoNames (CC BY 4.0), normalized by Referizz.