Packaging Module Development Engineer
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
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Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
Hillsboro, Oregon, United States
Pay posted by employer$115,110–$219,550 USD per year
Hillsboro, Oregon, United States
Pay posted by employer$99,030–$139,810 USD per year
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$188,890 USD per year
Toronto, Ontario, Canada
Pay posted by employer$155,888–$220,069 CAD per year
Toronto, Ontario, Canada
Pay posted by employer$114,890–$162,190 CAD per year
Albuquerque, New Mexico, United States
Pay posted by employer$76,390–$146,440 USD per year
Santa Clara, California, United States +1 location
Pay posted by employer$141,910–$200,340 USD per year
Folsom, California, United States +3 locations
Pay posted by employer$220,920–$311,890 USD per year
Kulim, Kedah, Malaysia
Taiwan, Taipei
Malaysia, Penang +1 location
Malaysia, Penang
Hillsboro, Oregon, United States
Pay posted by employer$191,220–$269,950 USD per year
Malaysia, Penang
Malaysia, Penang
Hillsboro, Oregon, United States
Pay posted by employer$211,400–$298,440 USD per year
Austin, Texas, United States
Pay posted by employer$122,440–$232,190 USD per year
Phoenix, Arizona, United States
Pay posted by employer$115,110–$219,550 USD per year
Malaysia, Penang
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.