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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.
Phoenix, Arizona, United States
Pay posted by employer$120,860–$231,670 USD per year
… of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the …
Phoenix, Arizona, United States
Pay posted by employer$76,390–$146,440 USD per year
… of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the …
Leixlip, Leinster, Ireland
Job Description Role and Impact Join Intel Wafer Packaging Manufacturing WPM C4 Ireland as a Module Engineer, and play a key role in advancing one of Intel most important manufacturing operations. Wafer Packaging …
Malaysia, Penang
The Role and Impact As a Module Engineer, you will play a pivotal role in ensuring the seamless operation and optimization of high-volume …
Malaysia, Penang
… sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance …
Kulim, Kedah, Malaysia
The Role and Impact As a Module Engineer, you will be at the forefront of driving the mass production of advanced integrated circuits. You will take …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$255,200 USD per year
The Role and Impact: As a Module Development Engineer, you will play a critical role in advancing Intel's semiconductor technologies by …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$188,890 USD per year
As a Module Development Engineer, you will be at the forefront of Intel's semiconductor manufacturing innovation, …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$188,890 USD per year
… become increasingly rigorous. The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and …
Malaysia, Penang
Hillsboro, Oregon, United States
Pay posted by employer$155,520–$219,550 USD per year
The Role and Impact As a Module Development Engineer within Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you …
Kulim, Kedah, Malaysia
… in circuit board technology, assembly processes, and materials. In this role, you will be a Packaging Module Development Engineer focuses on process, equipment, materials technology development for SMT processes and …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
The Packaging Module Development Engineer develops assembly processes and/or equipment and applies novel concepts for innovative …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
… ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology & Manufacturing (APTM) team in Chandler, …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
… package assembly solutions and scales them for high-volume manufacturing. We are seeking a Packaging Module Development Engineer to join our campus in Chandler, Arizona. In this role, you will contribute to …
Albuquerque, New Mexico, United States
Pay posted by employer$103,730–$146,440 USD per year
… with New Mexico Die Sort (NM DS) serving as a key segment of the manufacturing operation. As a Die Sort Module Engineer, you will play an essential role in ensuring the efficiency and reliability of high-volume manufacturing …
Kulim, Kedah, Malaysia
The Role and Impact As a Die Prep Module Engineer specializing in Advanced Metrology, you will own the performance, capability, and reliability of critical …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$255,200 USD per year
… become increasingly rigorous. The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and …
Kulim, Kedah, Malaysia
Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM Process …
Phoenix, Arizona, United States
Pay posted by employer$85,200–$139,810 USD per year
… we create world-changing technology that improves the life of every person on the planet. Intel's Packaging Module Development team is dedicated to designing and optimizing cutting-edge assembly and packaging solutions …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
