119 matching jobs for “Module Engineer”

How results work

Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.

Intel

Packaging Module Development Engineer

Kulim, Kedah, Malaysia

Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM Process …

Added Oct 27, 2026

Save job

Intel

Packaging Module Equipment Development Engineer

Phoenix, Arizona, United States

Pay posted by employer$85,200–$139,810 USD per year

… we create world-changing technology that improves the life of every person on the planet. Intel's Packaging Module Development team is dedicated to designing and optimizing cutting-edge assembly and packaging solutions …

Added Oct 30, 2026

Save job

Intel

Principal Engineer, Hybrid Bonding Module

Hillsboro, Oregon, United States

Pay posted by employer$211,400–$298,440 USD per year

As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling …

Added Oct 27, 2026

Save job

Intel

Packaging Module Equipment Development Engineer

Phoenix, Arizona, United States

Pay posted by employer$99,030–$188,890 USD per year

… people's digital lives. Come join us and do something wonderful. The Role and Impact Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's …

Added Oct 27, 2026

Save job

Intel

Intel Foundry Module Development Engineer

Hillsboro, Oregon, United States

Pay posted by employer$133,800–$188,890 USD per year

… shape the future for decades to come. Intel Foundry Technology and Development (TD) team is looking for an engineer for the Lithography team. TD Lithography Module Engineers are responsible for the development and execution …

Added Oct 27, 2026

Save job

Intel

Thin Films Module Development Engineer

Hillsboro, Oregon, United States

Pay posted by employer$155,520–$255,200 USD per year

Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by …

Added Oct 31, 2026

Save job

Intel

Module Engineer for Assembly Department

Ho Chi Minh City, Ho Chi Minh City (HCMC), Vietnam

The Role and Impact As a Module Engineer, you will be at the forefront of managing and optimizing high-volume manufacturing equipment and processes …

Added Oct 27, 2026

Save job

Intel

Module Development Defect Metrology Engineer

Hillsboro, Oregon, United States

Pay posted by employer$155,520–$219,550 USD per year

As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor …

Added Oct 27, 2026

Save job

Intel

Intel Foundry Module Development Engineer

Hillsboro, Oregon, United States

Pay posted by employer$133,800–$255,200 USD per year

… amazing product roadmap. Look at Life Inside Intel here . What you will be considered for: Intel Foundry Module Development Engineers are responsible for leading scientific research enabling the manufacture of …

Added Oct 27, 2026

Save job

Intel

Thin Films Module Development Engineer

Hillsboro, Oregon, United States

Pay posted by employer$133,800–$188,890 USD per year

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of …

Added Oct 27, 2026

Save job

Intel

Packaging Module Equipment Development Engineer

Phoenix, Arizona, United States

Pay posted by employer$133,800–$188,890 USD per year

… broader goals of technological leadership and global customer success. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in …

Added Oct 27, 2026

Save job

Intel

Module Engineer On Shift (MEOS)

Phoenix, Arizona, United States

Pay posted by employer$85,200–$162,500 USD per year

… and ready to make a real impact from day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts. In this role, you will be at …

Added Oct 27, 2026

Save job

Intel

Oregon Advanced Packaging Module Engineer

Hillsboro, Oregon, United States

Pay posted by employer$76,390–$146,440 USD per year

… and driving the innovations that shape the future of computing. We are seeking an Oregon Advanced Packaging Module Engineer to join our advanced manufacturing operations in Hillsboro, Oregon. In this role, you will play a critical …

Added Oct 28, 2026

Save job

Intel

Module Development Engineer - RF Test

Phoenix, Arizona, United States

Pay posted by employer$155,520–$219,550 USD per year

… Note: This role requires regular onsite presence to fulfill essential job responsibilities. As an RF Module Development Engineer, you will be at the forefront of driving innovation and quality in analog and RF test. …

Added Oct 27, 2026

Save job

Intel

Module Development Engineer - RF Test

Phoenix, Arizona, United States

Pay posted by employer$115,110–$219,550 USD per year

Added Oct 27, 2026

Save job

Intel

Sort Probe Card Module Engineer

Albuquerque, New Mexico, United States

Pay posted by employer$103,730–$146,440 USD per year

… New Mexico Die Sort (NM DS) serving as a key segment of the manufacturing operation. As a Sort Probe Card Module Engineer within the NM DS Probe Card Metrology (PCM) team, you will play an essential role in ensuring the …

Added Oct 29, 2026

Save job

Intel

Advanced Packaging Module Development Engineer

Hillsboro, Oregon, United States

Pay posted by employer$133,800–$255,200 USD per year

… technological challenges. We are seeking a highly motivated and technically skilled Process Integration Engineer to join our dynamic team in Hillsboro, Oregon. In this critical role, you will be at the intersection of …

Added Oct 27, 2026

Save job

Intel

Module Engineer PhD Intern New 2027

Hillsboro, Oregon, United States

Pay posted by employer$120,898–$120,902 USD per year

The Role and Impact As a Module Engineering PhD Intern, you will actively contribute to the development and optimization of manufacturing …

Added Oct 27, 2026

Save job

Intel

(Epi) - Module Development Engineer - (PhD Intern)

Hillsboro, Oregon, United States

Pay posted by employer$120,898–$120,902 USD per year

The Role and Impact As a Module Engineering PhD Intern, you will contribute to the optimization and development of manufacturing processes …

Added Oct 27, 2026

Save job

Intel

Intel Mask Operations Module Development Engineer

Hillsboro, Oregon, United States

Pay posted by employer$133,800–$188,890 USD per year

… working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will be an integral contributor to the ongoing production of photolithography masks for Intel's …

Added Oct 27, 2026

Save job

Intel

Packaging Module Development Engineer

Kulim, Kedah, Malaysia

View job

Save job

Qualifications · employer excerpt

BEng/MEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics),
Research and Development background from MSc/PhD is preferred.
More than 2 years working experience in electronic packaging AND/OR development experience is required.
Open to fresh graduate with strong academic result.
Research and Development background and experience in Chip Attach, Deflux or Ball Attach Process.

4 more in the full description below.

About this opportunity

Original employer description

Job Details:

Job Description:

Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization.
CAM/SLAM Process covers Die and DRAM Attach, Component Attach, Solder Ball Attach and Deflux Process.
Candidate will focus on Process and Technology Development for Electronic packaging assembly process on New Product and Test Vehicle.
Technical knowledge in Research and Development, Process Development, Process Engineering, Design of Experiment (DOE), Statistical Process Control (SPC), Failure Modes/Effects Analysis (FMEA), Quality, Yield Improvement, Optimization.
Pathfinding, developing, qualifying, and ramping materials to transfer to high volume manufacturing process in factories.
Develops process specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Conducting fundamental studies and performing experiments to characterize materials, process, identify potential failure modes, understand the performance interactions, optimization, assess feasibility of technology use on product, and make technology recommendations.
Collaborating closely with other cross-functional team to build material technologies on test vehicles and products and assessing their performance.

Qualifications:

BEng/MEng/MSc/PhD degree in relevant engineering disciplines (Mechanical, Materials, Chemical, Electrical, Physics, Mechatronics),
Research and Development background from MSc/PhD is preferred.
More than 2 years working experience in electronic packaging AND/OR development experience is required.
Open to fresh graduate with strong academic result.
Research and Development background and experience in Chip Attach, Deflux or Ball Attach Process.
Excellent influencing, written and verbal communication skills.
Strong data analysis capabilities and problem solving skills.
Proactive and positive approach towards challenges.
Able to work under tight timelines and schedules, and perform under pressure.

Job Type:

Experienced Hire

Shift:

Shift 1 (Malaysia)

Primary Location:

Malaysia, Kulim

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Why this result? · Employer labels

All keywords in title

Location reference: GeoNames (CC BY 4.0), normalized by Referizz.