145 matching jobs for “Yield Development Engineer”

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Intel

Equipment Development Engineer

Japan, Tokyo

We are seeking a highly motivated engineer to support the METI-SATAS program, focused on development, integration, and deployment of next-generation …

Added Oct 27, 2026

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Intel

Module Development Engineer

US, Oregon, Hillsboro

Pay posted by employer$133,800–$188,890 USD per year

As a Module Development Engineer, you will be at the forefront of Intel's semiconductor manufacturing innovation, driving the …

Added Oct 27, 2026

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Intel

Customer Product Development Engineer

US, Arizona, Phoenix +1 location

Pay posted by employer$141,910–$269,100 USD per year

… role in Intel's transition from IDM to Foundry. Customer Engineering is an integral part of Manufacturing Development and Customer Engineering (MDCE), responsible for improving yield and performance on high-volume …

Added Oct 29, 2026

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Intel

Packaging Module Development Engineer

Malaysia, Kulim

Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

US, Oregon, Hillsboro

Pay posted by employer$155,520–$219,550 USD per year

The Role and Impact As a Module Development Engineer within Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you will …

Added Oct 30, 2026

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Intel

Process Integration Development Engineer

US, Oregon, Hillsboro

Pay posted by employer$115,110–$219,550 USD per year

… person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel At Intel's Logic Technology Development (LTD) we have continued to extend Moore's law to be world leaders in computing technology. To achieve the …

Added Oct 28, 2026

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Intel

LTD Product Development Engineer

US, Oregon, Hillsboro

Pay posted by employer$141,910–$200,340 USD per year

… customers' needs with precision. Life at Intel: https://jobs.intel.com/en/life-at-intel As an LTD Product Development Engineer, you will play a pivotal role in advancing our technology. This position involves developing and …

Added Oct 27, 2026

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Intel

Process Integration Development Engineer

US, Oregon, Hillsboro

Pay posted by employer$120,860–$231,670 USD per year

… person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Process Integration and Yield Engineer in Defect Metrology, you will play a pivotal role in shaping Intel's innovation and manufacturing …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

US, Arizona, Phoenix

Pay posted by employer$133,800–$188,890 USD per year

… part of Intel's Advanced Packaging Technology Manufacturing (APTM) division, which is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

Malaysia, Kulim

Surface Mount Technology Development (SMTD), part of Intel's Assembly Technology Development (ATD) packaging team, cater to Intel's customer …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

US, Arizona, Phoenix

Pay posted by employer$115,110–$219,550 USD per year

The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression …

Added Oct 27, 2026

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Intel

Testchip Product Development Engineer

Malaysia, Penang

The Role and Impact As a Product Development Engineer, you will play a pivotal role in ensuring the seamless manufacturability and testability of …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

US, Arizona, Phoenix

Pay posted by employer$133,800–$188,890 USD per year

The Packaging Module Development Engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

US, Arizona, Phoenix

Pay posted by employer$133,800–$188,890 USD per year

Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our …

Added Oct 28, 2026

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Intel

ATD Laser Development Engineer

US, Arizona, Phoenix

Pay posted by employer$85,200–$162,500 USD per year

The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

US, Arizona, Phoenix

Pay posted by employer$133,800–$188,890 USD per year

… is transforming what's possible. Our Arizona campuses are among the most advanced semiconductor research, development, and manufacturing facilities on the planet, and they're growing. Join us and be part of something truly …

Added Oct 28, 2026

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Intel

Advanced Packaging Development Engineer

US, Arizona, Phoenix

Pay posted by employer$133,800–$188,890 USD per year

The Role and Impact As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

US, Oregon, Hillsboro

Pay posted by employer$115,110–$219,550 USD per year

We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across …

Added Oct 27, 2026

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Intel

Packaging Module Development Engineer

US, Arizona, Phoenix

Pay posted by employer$115,110–$219,550 USD per year

… Intel's technology leadership in high-performance computing applications. We are seeking a Packaging Module Development Engineer to join our team in Chandler, Arizona. This unique hybrid position sits at the intersection of …

Added Oct 27, 2026

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Intel

Packaging Process Development Engineer

US, Arizona, Phoenix

Pay posted by employer$99,030–$188,890 USD per year

… workplace where diverse perspectives fuel creativity and drive meaningful impact. Intel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our Arizona-based …

Added Oct 27, 2026

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Intel

Equipment Development Engineer

Japan, Tokyo

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Minimum Qualifications · employer excerpt

Excellent communication in Japanese and English, and collaboration skills
Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Manufacturing, Systems, or related field)
7+ years of industry experience in process engineering, equipment development, systems integration, semiconductor manufacturing, or manufacturing automation.
5+ years of experience in project management and technical leadership
Strong experience with CAD tools, data analysis, and Microsoft Office applications

About this opportunity

Original employer description

Job Details:

Job Description:

We are seeking a highly motivated engineer to support the METI-SATAS program, focused on development, integration, and deployment of next-generation assembly and test process equipment, factory automation systems, and material handling solutions for a pilot line in Japan. This role spans the full equipment lifecycle-from requirements definition and design through supplier integration, installation, and qualification-in close collaboration with global Intel teams and external equipment and consortia partners. The position is based in Japan and includes hands-on engagement with suppliers and pilot line equipment, process engineering and operations.
The role may focus on process equipment engineering, factory automation and material handling systems, or end-to-end systems integration depending on program needs and candidate experience.

Multiple positions may be filled from this requisition across process equipment engineering, factory automation and material handling systems, and systems integration disciplines.

Key Responsibilities

Define and drive equipment capability requirements across hardware, software, and controls in collaboration with internal teams and suppliers
Own and drive deliverables for assigned scope, ensuring alignment to program goals, schedule commitments, performance targets, and integration requirements
Lead design, development, and integration of assembly/test process equipment and automation systems, including automated material handling (AMHS), EFEMs, load ports, and process tools
Integrate multiple process tools and automation systems into a cohesive pilot line, ensuring synchronized material flow, system performance, and operational efficiency
Partner closely with equipment suppliers (consortia partners) through design, build, installation, and qualification phases
Execute equipment testing and validation, including unit, integration, and pilot line qualification activities
Drive improvements in equipment performance with a focus on reducing energy consumption and consumables/collateral waste, aligned to program productivity and sustainability targets
Contribute to and help drive development and adoption of industry standards (e.g., SEMI) for equipment interoperability
Develop and maintain technical documentation, including installation, operation, and maintenance procedures
Troubleshoot and resolve complex equipment, controls, and integration issues using structured problem-solving and data analysis
Track and communicate project progress, risks, and mitigation plans across stakeholders
Operate effectively in a fast-paced, evolving RnD environment with a high degree of ambiguity
Support development, optimization, qualification, and deployment of assembly/test manufacturing processes and associated equipment.
Drive process capability improvements and manufacturing readiness activities in collaboration with suppliers and pilot-line stakeholders.

Qualifications:

Minimum Qualifications

Excellent communication in Japanese and English, and collaboration skills
Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Manufacturing, Systems, or related field)
7+ years of industry experience in process engineering, equipment development, systems integration, semiconductor manufacturing, or manufacturing automation.
5+ years of experience in project management and technical leadership
Strong experience with CAD tools, data analysis, and Microsoft Office applications

Preferred Qualifications

Experience with semiconductor manufacturing process equipment, especially in assembly and test
Experience with semiconductor process development, process characterization, qualification, troubleshooting, and manufacturing optimization.
Familiarity with SEMI standards and equipment interoperability requirements
Experience with semiconductor material handling systems, including FOUPs, trays, EFEMs, load ports, AMHS (stockers, OHV, PGV, AMR), and sorter/handling systems
Experience with industrial controls, factory automation systems, and equipment integration
Experience working in pilot line, RnD factory, or multi-tool integration environments
Familiarity with equipment or process improvements targeting energy efficiency and consumables/material waste reduction
Strong supplier and stakeholder management experience in a global environment
Knowledge and experience with equipment automation, control systems, and software systems is helpful.

Job Type:

Intel Contract Employee

Shift:

Shift 1 (Japan)

Primary Location:

Japan, Tokyo

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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