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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.
Phoenix, Arizona, United States
Pay posted by employer$99,030–$139,810 USD per year
… planet. Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of global customers. We collaborate with world-class engineers, contribute …
Kulim, Kedah, Malaysia
Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located …
Phoenix, Arizona, United States
Pay posted by employer$85,200–$120,280 USD per year
As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and …
Hillsboro, Oregon, United States
Pay posted by employer$180,770–$255,200 USD per year
Intel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean as well as Plating technology development for 3DIC platform. …
Bengaluru, Karnataka, India
The Role and Impact: As a GPU Software Development Engineer, you will focus on enabling and optimizing Intel's GPUs by developing, backporting, and validating …
Santa Clara, California, United States
Pay posted by employer$122,440–$232,190 USD per year
… lives. Come join us and do something wonderful. The team is seeking an experienced Silicon Photonics Test engineer for the development of Photonics Integrated Circuits (PIC), sub-system, reference module test stations to …
Santa Clara, California, United States
Pay posted by employer$164,470–$269,100 USD per year
… and component performance optimization opportunities Define system specifications driving component development and tradeoffs Work cross-organizationally to validate photonic link and system understanding with …
Hillsboro, Oregon, United States
Pay posted by employer$141,910–$200,340 USD per year
… Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a Semiconductor Research Engineer, you will drive cutting edge design, simulation, development, and implementation activities for scientific …
Hillsboro, Oregon, United States
Pay posted by employer$89,010–$125,660 USD per year
… strives to make every facet of semiconductor manufacturing state-of-the-art. From semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly advanced die prep …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
As a Low Yield Analysis (LYA) Engineer within Intel Foundry's Defect Characterization organization, you will drive root cause identification and …
Phoenix, Arizona, United States
Pay posted by employer$115,110–$219,550 USD per year
… the opportunity to do meaningful work that truly matters — at scale. We are seeking a talented and driven Module Development Engineer to join our Sort Test Technology Development (STTD) team within Intel's Advanced …
Hillsboro, Oregon, United States
Pay posted by employer$120,860–$231,670 USD per year
… on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Sort/Test Quality & Reliability Engineer, you will lead quality and reliability readiness for tester hardware, test modules, test processes, …
Hillsboro, Oregon, United States
Pay posted by employer$99,030–$139,810 USD per year
… to help root cause yield loss and in-line failures. In this electrical-characterization hybrid role, the engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and …
Kulim, Kedah, Malaysia
The Role and Impact: As a Module Engineering Manager, you will lead a team of talented engineers and manufacturing professionals to ensure …
Hillsboro, Oregon, United States
Pay posted by employer$191,220–$269,950 USD per year
… Foundry is seeking a technical manager to serve as a senior technical authority within Logic Technology Development, LTD Wet Etch and Cleans. This is a hands-on individual contributor role with potential for limited …
Phoenix, Arizona, United States
Pay posted by employer$180,770–$255,200 USD per year
… and execution-focused EMIB-T Substrate Yield Lead to lead yield performance for next-generation advanced packaging technologies, including EMIB-T (Embedded Multi-die Interconnect Bridge with TSV) , Intel's most advanced …
Phoenix, Arizona, United States
Pay posted by employer$60,450–$85,340 USD per year
… world-changing technology that improves the life of every person on the planet. By joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization, you will be at the forefront …
Phoenix, Arizona, United States
Pay posted by employer$60,450–$116,640 USD per year
As a Module Equipment Technician, you will play an essential role in supporting Intel's cutting-edge semiconductor …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
