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US, Oregon, Hillsboro
Pay posted by employer$133,800–$188,890 USD per year
Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced …
Malaysia, Penang
The Role and Impact As an Analog Product Development Engineer, you'll play a pivotal role in ensuring the manufacturability and testability of cutting-edge …
Malaysia, Kulim
Become a member of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located …
US, Arizona, Phoenix
Pay posted by employer$115,110–$219,550 USD per year
… Note: This role requires regular onsite presence to fulfill essential job responsibilities. As an RF Module Development Engineer, you will be at the forefront of driving innovation and quality in analog and RF test. You will …
US, Oregon, Hillsboro
Pay posted by employer$155,520–$219,550 USD per year
As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor manufacturing and …
US, Arizona, Phoenix
Pay posted by employer$85,200–$139,810 USD per year
… world-changing technology that improves the life of every person on the planet. Intel's Packaging Module Development team is dedicated to designing and optimizing cutting-edge assembly and packaging solutions across Intel's …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$188,890 USD per year
… generation of technologies that will shape the future for decades to come. Intel Foundry Technology and Development (TD) team is looking for an engineer for the Lithography team. TD Lithography Module Engineers are …
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
… goals of technological leadership and global customer success. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in developing …
US, Oregon, Hillsboro +4 locations
Pay posted by employer$133,800–$255,200 USD per year
… Intel strives to make every aspect of semiconductor manufacturing state of the art, from process development and manufacturing to yield improvement, packaging, final test, optimization, and world-class supply chain …
US, Arizona, Phoenix
Pay posted by employer$155,520–$219,550 USD per year
… Note: This role requires regular onsite presence to fulfill essential job responsibilities. As an RF Module Development Engineer, you will be at the forefront of driving innovation and quality in analog and RF test. You will …
US, Arizona, Phoenix
Pay posted by employer$99,030–$188,890 USD per year
… digital lives. Come join us and do something wonderful. The Role and Impact Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's future …
US, Oregon, Hillsboro
Pay posted by employer$115,110–$219,550 USD per year
… person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel At Intel's Logic Technology Development (LTD) we have continued to extend Moore's law to be world leaders in computing technology. To achieve the …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$188,890 USD per year
… person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel At Intel's Logic Technology Development (LTD), we have continued to extend Moore's law to be world leaders in computing technology. To achieve the …
US, Oregon, Hillsboro
Pay posted by employer$99,030–$139,810 USD per year
… person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel At Intel's Logic Technology Development (LTD), we have continued to extend Moore's law to be world leaders in computing technology. To achieve the …
US, Oregon, Hillsboro +1 location
Pay posted by employer$155,520–$298,440 USD per year
… of Semiconductor Manufacturing at Intel Join Intel's newest and most innovative organization—Manufacturing Development Customer Engineering (MDCE)—where you'll bridge the critical gap between breakthrough technology …
US, Oregon, Hillsboro
Pay posted by employer$115,110–$219,550 USD per year
Business Group Intel Foundry Technology Development is committed to delivering world-class manufacturing solutions that power Intel's product roadmap. The team …
Taiwan, Taipei
Job Description: This position is in the Logic Technology Development (LTD) team working in one of the most advanced semiconductor cleanroom facilities in the world. You will be …
Taiwan, Taipei
… material inspection methodology, conducts studies related to cost control, process control, and production yield, and implements plans and programs to optimize supply chain. Supports product long range plan development …
US, Oregon, Hillsboro
Pay posted by employer$120,898–$120,902 USD per year
… challenges behind leading-edge Gate-All-Around (GAA) transistor technology. Join Intel’s Technology Development Foundry Engineering team and contribute to advanced semiconductor process development at the intersection …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$188,890 USD per year
… This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
