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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.
Taiwan, Taipei
Job Description: This position is in the Logic Technology Development team working in one of the most advanced semiconductor cleanroom facilities in the world. You will be …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$188,890 USD per year
About the Role Intel Logic Technology Development (LTD) designs and scales the advanced semiconductor process technologies that power future generations of …
US, Arizona, Phoenix
Pay posted by employer$85,200–$120,280 USD per year
As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and …
US, Oregon, Hillsboro
Pay posted by employer$98,390–$138,900 USD per year
This position is in the Logic Technology Development team working in one of the most advanced semiconductor cleanroom facilities in the world. You will be …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
This position is in the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. You will design, …
Malaysia, Penang
The Role and Impact As an Analog Product Development Engineer, you will play a critical role in driving the testability and manufacturability of analog and RF …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
… strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
… the next big thing starts with you. We are seeking a talented and driven Sort Interface Pathfinding and Development Engineer to join our Sort Interface Development team in Oregon. In this high-impact role, you will pioneer …
US, New Mexico, Albuquerque
Pay posted by employer$155,520–$255,200 USD per year
The Role and Impact As a Module Development Engineer, you will lead the design, development, and optimization of cutting-edge manufacturing processes …
US, Oregon, Hillsboro +2 locations
Pay posted by employer$191,220–$269,950 USD per year
… (FCO) and Strategic Planning organization is seeking a visionary, high-impact Grade 10 Strategic / Development Industrial Engineer to lead the next era of operational transformation across our planning and capacity …
US, Oregon, Hillsboro
Pay posted by employer$120,898–$120,902 USD per year
As a Process Integration and Yield Engineering PhD Intern, you will play a key role in contributing to advanced semiconductor manufacturing …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$219,550 USD per year
The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative …
US, Oregon, Hillsboro +2 locations
Pay posted by employer$89,098–$89,102 USD per year
… Module Development Engineer Process Integration and Yield Engineer Semiconductor Manufacturing Engineer Yield Development Engineer Explore career paths in process and technology development, advanced manufacturing, yield engineering, …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$188,890 USD per year
Shape the Atomic Frontier of Semiconductor Innovation At Intel Foundry Technology and Development (TD), we don't just participate in technology development; we engineer physical reality at the angstrom …
US, Oregon, Hillsboro +2 locations
Pay posted by employer$76,398–$76,402 USD per year
… and operations teams. Develop and optimize semiconductor manufacturing processes. Analyze data to improve yield, quality, reliability, and factory performance. Work with advanced semiconductor equipment and fabrication …
US, Oregon, Hillsboro +3 locations
Pay posted by employer$224,970–$317,600 USD per year
About the Team Logic Technology Development (LTD) develops and delivers Intel's leading-edge silicon process technologies for both Intel products and …
US, Oregon, Hillsboro
Pay posted by employer$180,770–$255,200 USD per year
Intel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean as well as Plating technology development for 3DIC platform. This role …
Ireland, Leixlip
Intel Ireland Device Engineering team (Yield department) is looking for Device Engineering talents (reporting to manger of Device team) to join our …
US, Arizona, Phoenix
Pay posted by employer$120,860–$231,670 USD per year
… that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the …
US, Arizona, Phoenix
Pay posted by employer$76,390–$146,440 USD per year
… that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
