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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.
Hillsboro, Oregon, United States
Pay posted by employer$115,110–$219,550 USD per year
… the high-volume manufacturing phase while maintaining high-quality standards. In the MIE organization, we engineer world-class yields on D1 processes by driving critical Fab and E-Test parameters to Best-in-Class targets. …
Phoenix, Arizona, United States
Pay posted by employer$85,200–$162,500 USD per year
The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor …
Hillsboro, Oregon, United States
Pay posted by employer$52,000–$200,000 per year
… manufacturing equipment that powers the future of semiconductor innovation. As a Lithography Tool Install Engineer , you will be responsible for planning, coordinating, and executing installation projects for advanced …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
The Role and Impact As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and …
Hillsboro, Oregon, United States
Pay posted by employer$141,910–$200,340 USD per year
… Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a Semiconductor Research Engineer, you will drive cutting edge design, simulation, development, and implementation activities for scientific …
Kulim, Kedah, Malaysia
… of the Assembly Test Technology Development in the Media, Inspection, Handling Systems, and Laser (MIHL) Module engineering team. The role is located in Kulim as a Handling Systems development engineer leading the …
Bengaluru, Karnataka, India 2 postings
… effective package and system. Independently plan, design and develop quality custom lead frame/substrate/module with supporting electrical simulation to reduce cross-talk, IR drop, and noise issues of the device. …
Santa Clara, California, United States
Pay posted by employer$122,440–$232,190 USD per year
… lives. Come join us and do something wonderful. The team is seeking an experienced Silicon Photonics Test engineer for the development of Photonics Integrated Circuits (PIC), sub-system, reference module test stations to …
Phoenix, Arizona, United States
Pay posted by employer$99,030–$188,890 USD per year
… workplace where diverse perspectives fuel creativity and drive meaningful impact. Intel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$255,200 USD per year
… and factory teams to ensure robust, predictable silicon delivery. About the Role MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals …
Phoenix, Arizona, United States
Pay posted by employer$115,110–$219,550 USD per year
… the opportunity to do meaningful work that truly matters — at scale. We are seeking a talented and driven Module Development Engineer to join our Sort Test Technology Development (STTD) team within Intel's Advanced …
Hillsboro, Oregon, United States
Pay posted by employer$99,030–$139,810 USD per year
… to help root cause yield loss and in-line failures. In this electrical-characterization hybrid role, the engineer on shift will be responsible for technical functions such as design, test, checkout, modifications, and …
Hillsboro, Oregon, United States
Pay posted by employer$120,860–$231,670 USD per year
… on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Sort/Test Quality & Reliability Engineer, you will lead quality and reliability readiness for tester hardware, test modules, test processes, …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
As a Low Yield Analysis (LYA) Engineer within Intel Foundry's Defect Characterization organization, you will drive root cause identification and …
Phoenix, Arizona, United States
Pay posted by employer$85,200–$120,280 USD per year
As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly …
Japan, Tokyo +1 location
The Role and Impact As a Supply Chain Engineer, you will play a pivotal role in shaping Intel's supply chain and logistics strategy, driving innovation, …
Hillsboro, Oregon, United States
Pay posted by employer$89,010–$125,660 USD per year
… network of manufacturing, advanced packaging, and assembly/test facilities. As a Quality and Reliability Engineer (QRE), you will be part of FQRL (Foundry Quality, Reliability, and Labs), Intel's Quality and Reliability …
Hillsboro, Oregon, United States +1 location
Pay posted by employer$133,800–$255,200 USD per year
… for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, …
Taiwan, Taipei
… data analysis, as well as extensive interaction with other technology development teams (integration, module, design/modeling and reliability) Lead a team of device and process engineers to develop a high-volume …
Hillsboro, Oregon, United States +1 location
Pay posted by employer$155,520–$298,440 USD per year
… technology development and high-volume manufacturing. As a Senior Wet Etch Manufacturing Development Engineer, you'll be at the forefront of advancing next-generation semiconductor technologies that power the world's …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
