141 matching jobs for “Yield Development Engineer”

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Intel

Senior Process Integration Engineer

Taiwan, Taipei +1 location

The Role and Impact As a Process Integration Development Engineer, you will drive revolutionary advancements in substrate manufacturing technologies, ensuring …

Added Oct 27, 2026

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Intel

Circuit Design Engineer

US, California, Folsom

Pay posted by employer$105,650–$149,150 USD per year

The Role and Impact As a Circuit Design Engineer, you will play a pivotal role in designing and optimizing cutting-edge digital circuits for custom blocks …

Added Oct 27, 2026

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Intel

Process and Equipment Engineer

Malaysia, Kulim

The Role and Impact As a Process and Equipment Engineer specializing in Wafer Laser and Saw Singulation Technologies, you will serve as the technical owner …

Added Oct 29, 2026

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Intel

Foundry Device Engineer

US, Oregon, Hillsboro +2 locations

Pay posted by employer$161,550–$317,600 USD per year

… positioned to serve the next generation of chip design companies and technology leaders. The Manufacturing Development and Customer Engineering (MDCE) organization serves as the critical bridge between advanced technology …

Added Oct 27, 2026

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Intel

Module Engineer (Contract)

Malaysia, Penang

… manufacturing processes and equipment to ensure operational excellence, safety, quality, productivity, and yield performance. Analyze process, equipment, and production data to identify trends, develop actionable …

Added Oct 27, 2026

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Intel

Director, Process Engineer – Dry Etch

US, Oregon, Hillsboro +1 location

Pay posted by employer$211,400–$298,440 USD per year

… service provider, offering world-class manufacturing capabilities to customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at the forefront of this transformation, focusing on yield …

Added Oct 27, 2026

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Intel

Defect Metrology Engineer

Ireland, Leixlip

… to equipment challenges and influence required stakeholders to drive/implement change. Support recipe development, optimization, and transfers to ensure high-sensitivity defect detection capabilities . Qualifications: …

Added Oct 27, 2026

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Intel

Principal Engineer, Hybrid Bonding Module

US, Oregon, Hillsboro

Pay posted by employer$211,400–$298,440 USD per year

As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling …

Added Oct 27, 2026

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Intel

Senior Lithography and Photomask Process Engineer

Ireland, Leixlip

… protocols, and reticle lifecycle management across advanced EUV and DUV toolsets. • Advanced Pellicle Development: Drive next gen EUV pellicle development, material optimization for enhanced transmission, stability, …

Added Oct 27, 2026

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Intel

Principal Engineer- CPU Circuit Design

India, Bangalore

The Role and Impact As CPU Circuit Design Lead, you will lead the development of advanced digital circuits for custom blocks such as SRAM, register files, memory compilers, Custom Data …

Added Oct 27, 2026

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Intel

Analog Circuit Design Engineer

India, Bangalore

The Role and Impact: As an Analog Circuit Design Engineer, you will lead the design and development of high-speed analog circuits for advanced process nodes. Your …

Added Oct 27, 2026

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Intel

Supply Chain Engineer

US, Oregon, Hillsboro +1 location

Pay posted by employer$103,730–$198,820 USD per year

The Role and Impact As a Supply Chain Engineer, you will play an integral role in driving innovation and efficiency in Intel's supply chain ecosystem. You …

Added Oct 30, 2026

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Intel

Staff Chemical Mechanical Planarization (CMP) Engineer

US, Oregon, Hillsboro +1 location

Pay posted by employer$133,800–$255,200 USD per year

Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology …

Added Oct 30, 2026

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Intel

Senior ASIC DFT Engineer

Israel, Haifa

… of AI as a working tool, and actively use AI throughout our architecture, design, verification, and development workflows. If you are energized by defining things that have never existed before, value rigorous thinking, …

Added Oct 27, 2026

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Intel

Silicon Photonics TD Process/Product Integration Engineer

US, New Mexico, Albuquerque

Pay posted by employer$115,110–$219,550 USD per year

As a Silicon Photonics (SiP) Process or Product Integration Engineer, you will be part of Intel's SiP Process Development and Manufacturing (SPDM) team that is leading Intel's …

Added Oct 29, 2026

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Intel

Substrate Supplier Enablement Engineer

South Korea, Seoul

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate …

Added Oct 27, 2026

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Intel

Ocotillo Technology Fabrication Defect Metrology Equipment Engineer

US, Arizona, Phoenix

Pay posted by employer$89,010–$170,630 USD per year

… transfer all technology nodes in Arizona. They will drive rapid continuous improvements in safety, quality, yield, reliability, cost, process stability/capability, and productivity while maintaining rigorous quality …

Added Oct 27, 2026

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Intel

Transistor Reliability and Quality Engineer

US, Oregon, Hillsboro

Pay posted by employer$155,520–$219,550 USD per year

Intel is seeking a highly motivated and talented Transistor Quality and Reliability Engineer to join our Technology Development Quality and Reliability Engineering team. In this role, you will work at …

Added Oct 27, 2026

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Intel

Substrate Supplier Enablement Engineer

US, Arizona, Phoenix

Pay posted by employer$120,860–$198,820 USD per year

The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate …

Added Oct 27, 2026

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Intel

Semiconductor Research Integration Engineer

US, Oregon, Hillsboro

Pay posted by employer$141,910–$200,340 USD per year

… Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a Semiconductor Research Engineer, you will drive cutting edge design, simulation, development, and implementation activities for scientific …

Added Oct 27, 2026

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Intel

Senior Process Integration Engineer

Taiwan, Taipei +1 more

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Qualifications · employer excerpt

Minimum Qualifications • Bachelor's degree in Science or Engineering with 10+ years, a Master's degree with 8+ years, or a PhD with 6+ years of work experience in a relevant field. • 8+ years of experience in fab back-end or substrate…

About this opportunity

Original employer description

Job Details:

Job Description:

The Role and Impact
As a Process Integration Development Engineer, you will drive revolutionary advancements in substrate manufacturing technologies, ensuring smooth and efficient integration processes for next-generation packaging solutions. Your primary focus will be working closely with supplier engineering teams to develop and optimize processes, manage capacity, improve yield and enhance lead times. This role is pivotal to Intel's ability to deliver cutting-edge solutions to meet growing customer demand on EMIB-T advanced packaging solutions.

Business group
The role resides within Intel Corporation's Substrate Packaging Technology Development (SPTD) Dept and in the Substrate Integration Asia group, which focuses on advancing substrate packaging technologies to enable innovative solutions for heterogeneous chip architectures. The group collaborates with global teams and suppliers to deliver scalable manufacturing processes, supporting Intel's broader goals of technology leadership and innovation in advanced packaging.

Key Responsibilities
• Engage with supplier engineering teams and Intel's US integration group to advance substrate technologies and manage critical process interactions.
• Monitor, optimize, and enhance bottleneck processes to reduce throughput time (TPT) and improve efficiencies.
• Oversee schedules for product and test vehicle (TV) deliveries, resolving issues to meet aggressive on-time delivery (OTD) goals.
• Analyze substrate lead times, develop reduction roadmaps, and ensure quarterly lead time targets are met.
• Ensure supplier adherence to Process Control System (PCS) commitments.
• Collaborate with internal teams to design and implement factory certification plans focused on yield improvement.
• Develop milestone-driven micro-schedules for new factory startups, ensuring supplier compliance with startup timelines.
• Lead qualification activities and monitor ramp indicators to ensure seamless production ramp-up for new capacity.
• Influence strategic decision-making at supplier management levels through data-driven insights and recommendations.

• Expectation is for candidate to be at supplier factory on-site for minimum of 4 days a week.

Qualifications:

Minimum Qualifications
• Bachelor's degree in Science or Engineering with 10+ years, a Master's degree with 8+ years, or a PhD with 6+ years of work experience in a relevant field.
• 8+ years of experience in fab back-end or substrate manufacturing process development.
• Proficiency in supplier management, yield improvement and lead time analysis, with hands-on experience in structured problem-solving and supplier influence.

Preferred Qualifications
• Expertise in substrate process building blocks, including component embedding, laser drilling, dielectric lamination, lithography, multi-metal electrolytic plating, defect inspection/metrology, and electrical testing.
• Proven experience with process tool qualification in TD/ramp or HVM environments.
• Familiarity with factory operations, substrates, manufacturing, process engineering, and yield improvement.
• Fluent English communication skills, with exceptional presentation abilities and confidence to engage with supplier management.

We invite you to join our dynamic team and make an impact in shaping the future of advanced substrate packaging technologies.

Job Type:

Experienced Hire

Shift:

Shift 1 (Taiwan)

Primary Location:

Taiwan, Taipei

Additional Locations:

Taiwan, Hsinchu

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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