Intel
Die Prep Module Engineer (Contract Role)
Malaysia, Kulim
The Role and Impact As a Process and Equipment Engineer specializing in Pick and Place, PnP technology, you will be the technical owner driving the performance, …
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Yield Development Engineer · AnywhereEdit
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Intel
Senior Thin Films Metals Deposition Engineer
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
About the Group Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on …
Intel
Analog Circuit Design Engineer
India, Bangalore
… to join the IO Design Team in Bengaluru. In this role, you will be responsible for leading the design and development of advanced analog and mixed-signal circuits that enable high-speed chip-to-chip, package-to-package, and …
Intel
Module Engineer for Assembly Department
Vietnam, Ho_Chi_Minh_City
The Role and Impact As a Module Engineer, you will be at the forefront of managing and optimizing high-volume manufacturing equipment and processes …
Intel
Quantum Qubit Design Engineer
US, Oregon, Hillsboro +7 locations
Pay posted by employer$141,910–$269,100 USD per year
… the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly …
Intel
TD Memory Quality and Reliability Engineer
US, California, Folsom +2 locations
Pay posted by employer$155,520–$255,200 USD per year
About Us The Technology Development (TD) Quality and Reliability organization enables successful deployment of Intel's leading-edge process …
Intel
Sr. Substrates Engineering & Operations Engineer
Virtual South Korea
… material inspection methodology, conducts studies related to cost control, process control, and production yield, and implements plans and programs to optimize supply chain. Supports product long range plan development …
Intel
CUF TD Module Engineer
Malaysia, Kulim
… the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying …
Intel
Die Sort Module Engineer
US, New Mexico, Albuquerque
Pay posted by employer$103,730–$146,440 USD per year
… New Mexico Die Sort (NM DS) serving as a key segment of the manufacturing operation. As a Die Sort Module Engineer, you will play an essential role in ensuring the efficiency and reliability of high-volume manufacturing …
Intel
Silicon Packaging Design Engineer
India, Bangalore 2 postings
… and system level cost. Co-design with chip designer, system engineering and PCB design teams during the development stage to optimize pad layout and pin map for most cost effective package and system. Independently plan, …
Intel
Ocotillo Technology Fabrication DSIRE (Diffusion) Module Engineer
US, Arizona, Phoenix
Pay posted by employer$89,010–$170,630 USD per year
… shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) DSIRE (Diffusion) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the …
Intel
Member of Technical Staff - Thin Films Engineer
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
Organization Overview Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing …
Intel
Radio Frequency Test Process Engineer
US, Arizona, Phoenix
Pay posted by employer$115,110–$219,550 USD per year
… to do meaningful work that truly matters — at scale. We are seeking a talented and driven Module Development Engineer to join our Sort Test Technology Development (STTD) team within Intel's Advanced Packaging …
Intel
Qubit Control Physical Design Engineer
US, Oregon, Hillsboro
Pay posted by employer$141,910–$269,100 USD per year
The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will …
Intel
Senior Advanced Packaging Defect Inspection Engineer
US, Oregon, Hillsboro
Pay posted by employer$115,110–$219,550 USD per year
The Advanced Packaging Technology Development (APTD) Metrology Group at Intel sits at the heart of our most critical technology development and …
Intel
Module Engineer On Shift (MEOS)
US, Arizona, Phoenix
Pay posted by employer$85,200–$162,500 USD per year
… to make a real impact from day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts. In this role, you will be at the …
Intel
TFSM IR EHS Environmental Engineer
Ireland, Leixlip
In this position, you will be part of a site environmental team and will be responsible for the development, co-ordination, continuous improvement and management of site environmental programmes, such as hazardous …
Intel
Product Failure Analysis Engineer - SCAN Design for Test
US, Oregon, Hillsboro
Pay posted by employer$141,910–$269,100 USD per year
… a workplace where everyone can do their best work. We are seeking an experienced Product Failure Analysis Engineer - SCAN Design for Test who is excited by the opportunity to help enable the success of Intel Foundry's …
Intel
Sort/Test Quality & Reliability Engineer (QRE)
US, Oregon, Hillsboro
Pay posted by employer$120,860–$231,670 USD per year
… on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Sort/Test Quality & Reliability Engineer, you will lead quality and reliability readiness for tester hardware, test modules, test processes, …
Intel
Principal Engineer - Standard Cell Design
US, California, Santa Clara +4 locations
Pay posted by employer$220,920–$311,890 USD per year
… deliver power, performance, and scalability across future nodes and products. We're looking for a Principal Engineer who thrives on solving hard problems, someone who can bring deep circuit expertise and help define the …
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