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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
The Role and Impact As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing capabilities. …
Malaysia, Penang
The Role and Impact: We are seeking a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site, supporting Intel's advanced packaging programs (EMIB, …
US, New Mexico, Albuquerque
Pay posted by employer$103,730–$146,440 USD per year
… Die Sort (NM DS) serving as a key segment of the manufacturing operation. As a Sort Probe Card Module Engineer within the NM DS Probe Card Metrology (PCM) team, you will play an essential role in ensuring the …
Malaysia, Kulim
… will lead a team dedicated to ensuring the highest standards in product quality and reliability throughout development and high-volume manufacturing (HVM). In this role, you will oversee critical processes such as product …
US, Oregon, Hillsboro
Pay posted by employer$89,010–$125,660 USD per year
… strives to make every facet of semiconductor manufacturing state-of-the-art. From semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly advanced die prep …
Japan, Tokyo +1 location
The Role and Impact As a Supply Chain Engineer, you will play a pivotal role in shaping Intel's supply chain and logistics strategy, driving innovation, …
US, Oregon, Hillsboro
Pay posted by employer$190,610–$269,100 USD per year
About the Role Join Intel's architecture team as a Senior CPU Architecture and Benchmarking Engineer. You will drive rigorous, low-level investigations into CPU designs, crafting targeted microbenchmarks that …
US, Arizona, Phoenix
Pay posted by employer$103,730–$198,820 USD per year
The Role and Impact This Module Engineer role is specific to Ocotillo Technology Fabrication (OTF) Vacuum Systems Group (VSG). Successful candidates …
Vietnam, Ho_Chi_Minh_City
… and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and work with equipment suppliers as required. Own process development line items aligned to high volume …
Malaysia, Kulim
… training and audit processes for matched processing across sites. Plan and direct process engineering, yield improvement, and manufacturing efficiency enhancements. Develop and implement modifications to operating …
US, Oregon, Hillsboro
Pay posted by employer$120,898–$120,902 USD per year
The Role and Impact As a Module Engineering PhD Intern , you will contribute to the development, optimization, and implementation of advanced manufacturing processes within semiconductor production. In …
India, Bangalore
… based placement and routing template, and rigorous physical sign-off processes including DRC, LVS, Yield, DFM, Density, parasitic extraction, Noise Reliability i.e. EM, IR. You will provide technical guidance, …
US, Oregon, Hillsboro
Pay posted by employer$120,898–$120,902 USD per year
… manufacturing organization as a Module Engineering PhD Intern . In this role, you will contribute to the development, optimization, and sustainment of advanced semiconductor manufacturing processes within a specific process …
US, Oregon, Hillsboro
Pay posted by employer$120,898–$120,902 USD per year
… technology. In this position, you will work on challenging, hands-on projects that support the development, implementation, optimization, and continuous improvement of manufacturing processes within a specific …
Malaysia, Penang
The Role and Impact As a Manufacturing Engineering Equipment Manager, you will lead a team of engineer/technicians responsible for overseeing operations, equipment maintenance, and repair within Intel's …
US, Oregon, Hillsboro
Pay posted by employer$120,898–$120,902 USD per year
The Role and Impact Join Intel as a Module Engineering PhD Intern and contribute to the development of advanced semiconductor manufacturing technologies. In this role, you will work alongside experienced …
US, Oregon, Hillsboro
Pay posted by employer$191,220–$269,950 USD per year
… Foundry is seeking a technical manager to serve as a senior technical authority within Logic Technology Development, LTD Wet Etch and Cleans. This is a hands-on individual contributor role with potential for limited …
US, Arizona, Phoenix
Pay posted by employer$85,200–$162,500 USD per year
… business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer, you will develop and optimize assembly processes and equipment, applying innovative concepts to enable …
US, Arizona, Phoenix
Pay posted by employer$60,450–$116,640 USD per year
… investment in domestic semiconductor innovation and production. At Intel's Substrate Packaging Technology Development (SPTD) Labs, we foster a culture of collaboration, precision, and continuous improvement. Our teams are at …
US, Arizona, Phoenix
Pay posted by employer$60,450–$116,640 USD per year
… the vital technologies that power our connected world. Within Intel, the Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team is at the cutting edge of micro processing evolution. Our …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
