590 matching jobs for “Senior Chip Design Engineer”

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Applied Materials

Electrical Engineer II Senior

Bengaluru, Karnataka, India

Design or modify electrical or electronic engineering assemblies, layouts, schematics, drawings or specifications …

Added Oct 27, 2026

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Nvidia

Senior ASIC Verification Engineer - GPU

Santa Clara, California, United States

… Our ASIC Verification Engineers focus on developing the world’s top SoCs and GPUs. Joining us as a Senior ASIC Verification Engineer - GPU means working on modern technology powering consumer graphics and AI …

Added Oct 27, 2026

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Nvidia

Senior Firmware PHY Verification Engineer

Israel, Tel Aviv

NVIDIA is looking for an excellent Senior Firmware Verification Engineer for NVIDIA FW PHY verification Group. The person will be part of FW PHY …

Added Oct 27, 2026

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Nvidia

Senior Verification Engineer, Switch SoC

Bengaluru, Karnataka, India

We are currently seeking Verification Engineer with strong verification fundamentals to work in Switch Silicon group. You'll join a group of hardworking …

Added Oct 27, 2026

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Nvidia

Senior Silicon Validation Methodology Engineer

China, Shanghai

NVIDIA Silicon Co-Design Group (SCG) is a wide-ranging, multi-functional team at NVIDIA. We sit at the crossroads of design, …

Added Oct 27, 2026

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Nvidia

Senior HPC Site Reliability Engineer

Israel, Yokneam +1 location

We are now looking for a Senior HPC Site Reliability Engineer to join our mission and continue improving our HPC infrastructure. A …

Added Oct 27, 2026

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Applied Materials

Sr. Quantum Integration Engineer

Santa Clara, California, United States

Pay posted by employer$147,000–$202,500

… materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI …

Added Oct 27, 2026

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Analog Devices

Senior Engineer, Semi Packaging Engineering

Wilmington, Massachusetts, United States

Pay posted by employer$95,600–$131,450

… of What's Possible. Learn more at www.analog.com and on LinkedIn and X . We are seeking a highly motivated Senior Engineer, Systems Semiconductor Packaging Engineer to join a multidisciplinary team developing advanced …

Added Nov 3, 2026

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Nvidia

Senior Storage Platform Engineer

Santa Clara, California, United States

… like you to help us accelerate the next wave of artificial intelligence. Join our team at NVIDIA as a Senior Storage Platform Engineer responsible for designing, deploying, and operating the storage platforms that …

Added Oct 27, 2026

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Intel

Sr SOC Emulation Validation Engineer

Malaysia, Penang +1 location

… of hyper scale computing. This position involves validation of the next generation of Intel Client SoC Full chip, with a unique opportunity to work on next generation process nodes . Responsible to define next generation …

Added Oct 27, 2026

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KLA

Senior Electrical Development Engineer

Newport, United Kingdom

Full time
Regular

… created to strengthen this aspect of our business. As the successful candidate, you will be an experienced Engineer with an understanding of electrical, electronic and mechanical systems, and will be capable of building a …

Added Oct 15, 2026

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Applied Materials

Senior Manager, Systems Engineer

Singapore, Singapore

… new product development and sustaining engineering activities. Drive system architecture, electrical design, controls integration, and qualification of semiconductor equipment for advanced packaging applications. …

Added Oct 27, 2026

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Marvell Technology

Advanced Packaging Senior Engineer

Bucharest, Bucharest, Romania

Full time
Regular

… package designs that meet challenging electrical requirements. Many of the new designs are requiring multi-chip and multiple component configurations driving advanced technology requirements. There is the excitement of …

Added Nov 3, 2026

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Nvidia

Senior Product Development Engineer

Santa Clara, California, United States

… in the world of microelectronics. We are seeking a highly skilled and motivated Product Development engineer to drive bring up of innovative SOCs through collaboration with external vendors, design and production …

Added Oct 31, 2026

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Nvidia

Senior Package Layout Engineer - Hardware

Bengaluru, Karnataka, India 2 postings

… to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! …

Added Oct 27, 2026

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KLA

Senior Staff Optical Engineer

Milpitas, California, United States

Full time
Regular

Pay posted by employer$167,300–$245,367 per year

… coatings, complex optical subsystem and high-speed sensors. This position is responsible for the complete design process of one or multiple optical subsystems to support BBP roadmap: Provide technical leadership by …

Added Oct 15, 2026

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Applied Materials

Senior AI Engineer, Agentic AI

Bengaluru, Karnataka, India

… multi-agent orchestration, cloud native architectures, and enterprise AI platforms. Key Responsibilities Design, develop, and deploy LLM applications, RAG systems, multi-agent workflows, and scientific AI solutions, and …

Added Oct 27, 2026

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RTX

Senior Software Engineer - EW, Onsite

Goleta, California, United States

… product teams, often employing agile system and software development operations to plan, specify, design, test, and integrate complex software and systems solutions. Responsibilities include innovating creative …

Added Oct 27, 2026

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Nvidia

Senior Package Layout Engineer - Hardware

Santa Clara, California, United States +5 locations

Added Oct 27, 2026

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Marvell Technology

Senior Staff Test Engineer

Singapore

Full time
Regular

… customers. You will make sure we don’t ship out any underperforming units. You’ll work closely with design to make sure their chip features are testable and that the results meet the customer’s specifications. You …

Added Nov 3, 2026

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Analog Devices

Senior Engineer, Semi Packaging Engineering

Wilmington, Massachusetts, United States

Pay posted by employer$95,600–$131,450

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Minimum Qualifications · employer excerpt

Master's degree in Engineering (Mechanical Engineering, Materials Science, Semiconductor Engineering, Applied Physics, or equivalent).
Ph.D. in a relevant engineering or science discipline is preferred.
Must have 2-5 years of industrial experience in advanced semiconductor packaging, electronics assembly, systems integration engineering, or manufacturing engineering.
Candidates with a Ph.D. and limited industry experience are encouraged to apply, provided they demonstrate strong technical expertise relevant to semiconductor packaging, materials engineering, process development, or systems integration.
Experience working with OSATs, substrate vendors, EMS partners, and semiconductor manufacturing ecosystems.

6 more in the full description below.

About this opportunity

Original employer description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

We are seeking a highly motivated Senior Engineer, Systems Semiconductor Packaging Engineer to join a multidisciplinary team developing advanced semiconductor modules and systems level solutions for Healthcare, Industrial, New Energy, Robotics and Physical AI applications.

This role will drive product realization from concept through manufacturing by working closely with cross-functional design teams, OSAT, ODM and EMS partners, material suppliers and global manufacturing vendors across multiple time zones. The ideal candidate should have 2 - 5 years of experience in semiconductor packaging, system integration, manufacturing process development and reliability engineering.

We will consider candidates with a PhD and less industry experience.

Potential candidate is expected to:

Work closely with cross-functional teams to design and develop advanced systems level packaging solutions including heterogeneous packaging solutions, multi-chip modules, sensor packages and high-density interconnect assemblies.
Lead assembly process developments to support Digital Health Care, Medical Devices, Industrial, Robotics and Physical AI applications. Adheres to strict documentation practices in a regulated environment and owns design control processes. Engineer new materials, processes and assembly capabilities to suit to end applications.
Own manufacturing engineering activities including process characterization, collaborate with QA and Reliability teams to drive root cause analysis, yield improvements and Corrective/ preventive actions (CAPA) to meet manufacturability, scalability, and cost optimizations.
Drive PFMEA, DOE, SPC, GR&R and statical analysis activities to improve process capability, assembly robustness and long-term reliability.
Work closely with OSATs, substrate vendors, PCB suppliers and assembly partners to define package architecture, DFM/DFX requirements and qualification strategies. Takes accountability in design and process development for high volume production. Benchmark industry best practices and evaluate emerging technologies for design and process innovation.
Ability to collate information with appropriate supporting data and present into a coherent report for communication and distribution.
Communicate complex technical concepts effectively to global engineering, operations, suppliers and executive teams.

Minimum Qualifications

Master's degree in Engineering (Mechanical Engineering, Materials Science, Semiconductor Engineering, Applied Physics, or equivalent).
Ph.D. in a relevant engineering or science discipline is preferred.
Must have 2-5 years of industrial experience in advanced semiconductor packaging, electronics assembly, systems integration engineering, or manufacturing engineering.
Candidates with a Ph.D. and limited industry experience are encouraged to apply, provided they demonstrate strong technical expertise relevant to semiconductor packaging, materials engineering, process development, or systems integration.
Experience working with OSATs, substrate vendors, EMS partners, and semiconductor manufacturing ecosystems.
Strong understanding of advanced semiconductor packaging technologies, heterogeneous integration, multi-chip modules, materials, and assembly processes.
Familiarity with DOE, PFMEA, SPC, GR&R, 8D, RCA, design controls, and statistical analysis techniques.
Educational background in materials science and mechanical behavior of materials with the ability to apply engineering fundamentals to practical product design.
Experience with 3D CAD tools (SolidWorks or equivalent).
Excellent analytical, problem-solving, project management, and communication skills.
Experience in Medical Devices, Healthcare, Industrial Systems, Robotics, or regulated manufacturing environments is a strong advantage.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $95,600 to $131,450.

Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

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