922 matching jobs for “Yield Development Engineer”

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Booz Allen Hamilton

Data Engineer

Stafford, VA

Pay posted by employer$62,000–$141,000

Data Engineer The Opportunity: Ever-expanding technology like IoT, machine learning, and artificial intelligence means …

Added Oct 27, 2026

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Analog Devices

Semiconductor Packaging Engineer

Wilmington, Massachusetts, United States

Pay posted by employer$110,385–$151,808

As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in …

Added Nov 3, 2026

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Broadcom

Substrate Engineer

Taiwan-Hsinchu-Puding Road

Full time
Regular

… with Broadcom substrate subcontractors to manage and resolve issue relating to packaging, manufacturing, yield, quality, and delivery of high volume semiconductor devices. Responsible for NPI activities, risk …

Added Oct 20, 2026

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Applied Materials

Ramp Process Engineer (BEOL)

Singapore, Singapore

… and care for you at work, at home, or wherever you may go. Learn more about our benefits . As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and …

Added Oct 27, 2026

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Cisco Systems

Mechanical Engineer

Bengaluru, Karnataka, India

… support for on-going engineering from pre-concept through EOL. Work collaboratively with stakeholders in development of processes and technology to support new product development. BOM structuring and BOM risk Management. …

Added Oct 27, 2026

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Marvell Technology

Principal Test Engineer

Singapore

Full time
Regular

… and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact As a test development senior staff engineer in the Operations business group, you will test features on the silicon semiconductor …

Added Nov 3, 2026

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Applied Materials

Manufacturing Engineer

Bengaluru, Karnataka, India

… at home, or wherever you may go. Learn more about our benefits . Position Overview The E2S Manufacturing Engineer is responsible for developing, enabling, and sustaining repair solutions for semiconductor equipment …

Added Oct 27, 2026

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Applied Materials

Process Engineer

Santa Clara, California, United States +1 location

Pay posted by employer$108,000–$148,500

Added Oct 27, 2026

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Micron Technology

Distinguished Member of Technical Staff (DMTS) – Process Development, Cell Film, NAND

Fab 10N/X, Singapore

… technical problems via comprehensive RCA; advocate for cost savings, efficiency, and large-scale yield enhancement strategies. Initiate strategic collaborations with external partners/universities/research …

Added Nov 3, 2026

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Jabil

Lead Photonics System Engineer

Austin, Texas, United States +1 location

Pay posted by employer$105,100–$189,200

… and foster vibrant and diverse communities around the globe. Job Posting Title : Lead Photonics System Engineer Jabil is seeking a Lead Photonics System Engineer focused on enabling design and manufacturing services for …

Added Oct 28, 2026

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GE Vernova

Mechanical Design Engineer

Warsaw MZ PL 7

… an inclusive environment where your voice is heard, your curiosity is encouraged, and your professional development is a priority. We offer the opportunity to take true technical ownership of complex hardware while working …

Added Oct 27, 2026

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Analog Devices

Resident Engineer

Malaysia, Penang

… of What's Possible. Learn more at www.analog.com and on LinkedIn and X . To drive improvement on assembly yield, quality, delivery and cost on mass production products. To manage new product introduction at …

Added Nov 3, 2026

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RTX

Senior Systems Engineer

US-WA-POULSBO-WA1 ~ 26285 Twelve Trees Ln ~ TWELVE TREES

… problems. With our three market‑leading businesses, world‑class operations, and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science …

Added Oct 27, 2026

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KLA

Field Applications Engineer

Singapore, Singapore

Full time
Regular

… by delivering high-impact work across your area of expertise. Responsibilities: The selected Applications Engineer will join a dynamic team that makes a significant impact to the company every day. Responsible for …

Added Oct 15, 2026

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Cisco Systems

Wafer Test Engineer

Holmdel, New Jersey, US

Pay posted by employer$154,900–$225,300

… Monitor and sustain product flow in offshore production manufacturing to meet cost, delivery, and yield targets. Analyze characterization, qualification, and production data to set test limits, optimize yield, …

Added Oct 27, 2026

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Cisco Systems

Electrical Engineer

Bengaluru, Karnataka, India

… for ongoing engineering from pre-concept commit through EOL. Work collaboratively with stakeholders in the development of processes and technology to support new product development. BOM structuring and BOM risk Management. …

Added Oct 27, 2026

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Applied Materials

Process Integration Engineer

Santa Clara, California, United States

Pay posted by employer$147,000–$202,500

Added Oct 27, 2026

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Broadcom

Test Engineer (ATE)

San Jose, California, United States

Full time
Regular

Pay posted by employer$121,900–$195,000 USD per year

Broadcom is seeking a highly motivated Test Engineer to join our Semiconductor Test Engineering team. In this role, you will focus on development of production, …

Added Nov 3, 2026

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Broadcom

Test Engineer (ATE)

San Jose, California, United States

Full time
Regular

Pay posted by employer$82,500–$132,000 USD per year

Broadcom is seeking a highly motivated Test Engineer to join our Semiconductor Test Engineering team. In this role, you will focus on development of production, …

Added Oct 18, 2026

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Marvell Technology

Senior Staff Product Engineer

Singapore

Full time
Regular

… learn, and lead. Your Team, Your Impact Marvell is looking for highly motivated, talented Principal Product Engineer. You will part of a dynamic product engineering team working on most advanced technologies including Server …

Added Nov 3, 2026

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Analog Devices

Semiconductor Packaging Engineer

Wilmington, Massachusetts, United States

Pay posted by employer$110,385–$151,808

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Required Skills · employer excerpt

Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges

2 more in the full description below.

About this opportunity

Original employer description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

Senior Systems Semiconductor Packaging Engineer

About the Role

As a Senior Systems Semiconductor Packaging Engineer, you will lead the development of advanced semiconductor packaging solutions for MEMS sensors used in automotive, industrial, medical, aerospace, and defense applications. You will work across the product lifecycle, from concept through manufacturing readiness, helping translate product and customer requirements into robust, scalable packaging solutions.

This role calls for strong technical judgment, cross-functional collaboration, and hands-on problem solving. You will partner closely with teams across applications, quality, reliability, manufacturing, and external vendors to improve package performance, manufacturability, and time to market.

Key Responsibilities

Packaging Development: - Lead project-level semiconductor packaging design activities from product conception through manufacturing readiness
Manufacturability and Reliability: - Drive design for manufacturability and design for reliability through process characterization, risk assessment, and structured problem solving
Root Cause and Yield Improvement: - Partner with quality and reliability teams to perform root cause analysis, improve yield, and implement corrective and preventive actions
Engineering Analysis: - Perform detailed package analysis using 3D CAD tools such as SolidWorks and simulation tools such as ANSYS to evaluate mechanical and process performance
Process and Quality Methods: - Apply engineering methodologies including control plans, PFMEA, DOE, SPC, 8D, and RCA to improve product and process outcomes
Customer Requirements Translation: - Partner with Applications Engineering to translate customer specifications into clear technical direction for internal development teams
OSAT Collaboration: - Work with OSAT partners to support rapid prototyping, early builds, and preliminary qualification activities
Vendor and Assembly Readiness: - Help reduce time to market by aligning package designs with vendor assembly capabilities and manufacturing constraints
Cross-Functional Leadership: - Collaborate with multidisciplinary teams to support execution, issue resolution, and product success across development phases

Required Skills

Semiconductor Packaging Expertise: - Strong experience in semiconductor packaging and manufacturing processes, with the ability to support package development from concept through release
Materials Knowledge: - Strong understanding of substrates, adhesives, underfills, mold compounds, and interconnect materials used in semiconductor packaging
Design for Reliability: - Experience applying reliability and manufacturability principles to package design, qualification readiness, and process optimization
Simulation and Analysis Tools: - Hands-on experience with 3D CAD and engineering analysis tools such as SolidWorks and ANSYS
Structured Problem Solving: - Demonstrated ability to apply DOE, PFMEA, SPC, 8D, RCA, and related methods to solve technical and manufacturing challenges
Cross-Functional Collaboration: - Ability to work effectively across applications, manufacturing, quality, reliability, and external partner teams
Technical Communication: - Strong communication skills with the ability to translate technical issues and requirements clearly across stakeholders

Preferred Education and Experience

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field
5+ years of relevant experience in semiconductor packaging, process development, or manufacturing engineering
Experience supporting MEMS, sensor, or advanced package development is a plus
Experience working with OSAT partners and external manufacturing vendors is preferred

We recognize that candidates may not meet every listed requirement. If you bring relevant experience and a willingness to learn, we encourage you to apply.

#LI-PG1

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Experienced

Required Travel: Yes, 10% of the time

Shift Type: 1st Shift/Days

The expected wage range for a new hire into this position is $110,385 to $151,808.

Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

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