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Kulim, Kedah, Malaysia
… essential job responsibilities. Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging …
Albuquerque, New Mexico, United States
Pay posted by employer$103,730–$146,440 USD per year
… with New Mexico Die Sort (NM DS) serving as a key segment of the manufacturing operation. As a Die Sort Module Engineer, you will play an essential role in ensuring the efficiency and reliability of high-volume manufacturing …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$255,200 USD per year
… become increasingly rigorous. The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and …
Kulim, Kedah, Malaysia
Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM Process …
Phoenix, Arizona, United States
Pay posted by employer$85,200–$139,810 USD per year
… we create world-changing technology that improves the life of every person on the planet. Intel's Packaging Module Development team is dedicated to designing and optimizing cutting-edge assembly and packaging solutions …
Hillsboro, Oregon, United States
Pay posted by employer$211,400–$298,440 USD per year
As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling …
Phoenix, Arizona, United States
Pay posted by employer$99,030–$188,890 USD per year
… people's digital lives. Come join us and do something wonderful. The Role and Impact Join Intel's Packaging Module Development team and play a pivotal role in pioneering assembly packaging technologies that drive Intel's …
Santa Clara, California, United States
Pay posted by employer$147,000–$202,500
… and development projects. Position Summary We are seeking a highly motivated Die-to-Wafer Hybrid Bonding Module Engineer to develop and scale next-generation hybrid bonding technologies for advanced semiconductor packaging …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$188,890 USD per year
… shape the future for decades to come. Intel Foundry Technology and Development (TD) team is looking for an engineer for the Lithography team. TD Lithography Module Engineers are responsible for the development and execution …
Hiroshima, Hiroshima, Japan +3 locations
Hillsboro, Oregon, United States
Pay posted by employer$155,520–$255,200 USD per year
Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization. The role will be defined by …
Ho Chi Minh City, Ho Chi Minh City (HCMC), Vietnam
The Role and Impact As a Module Engineer, you will be at the forefront of managing and optimizing high-volume manufacturing equipment and processes …
Hillsboro, Oregon, United States
Pay posted by employer$155,520–$219,550 USD per year
As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor …
San Jose, California, United States
Pay posted by employer$138,100–$196,500
… optics, and hardware platforms—like Silicon One—are shaping the technology industry. The Transceiver Module Group (TMG) within CHG is a collaborative and multi-functional product development and sustaining team …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$255,200 USD per year
… amazing product roadmap. Look at Life Inside Intel here . What you will be considered for: Intel Foundry Module Development Engineers are responsible for leading scientific research enabling the manufacture of …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$188,890 USD per year
Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
… broader goals of technological leadership and global customer success. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in …
Phoenix, Arizona, United States
Pay posted by employer$85,200–$162,500 USD per year
… and ready to make a real impact from day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts. In this role, you will be at …
Hillsboro, Oregon, United States
Pay posted by employer$76,390–$146,440 USD per year
… and driving the innovations that shape the future of computing. We are seeking an Oregon Advanced Packaging Module Engineer to join our advanced manufacturing operations in Hillsboro, Oregon. In this role, you will play a critical …
Phoenix, Arizona, United States
Pay posted by employer$155,520–$219,550 USD per year
… Note: This role requires regular onsite presence to fulfill essential job responsibilities. As an RF Module Development Engineer, you will be at the forefront of driving innovation and quality in analog and RF test. …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
