613 matching jobs for “IC Design Engineer”

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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.

Capital One Financial

Staff Full-Stack Engineer (Director IC)

McLean, Virginia, United States +3 locations

Staff Full-Stack Engineer (Director IC) As a Staff Engineer at Capital One, you will be part of a community of technical experts …

Added Oct 27, 2026

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Capital One Financial

Android Mobile Engineer 4 (Manager, IC)

New York City, New York, United States

… purposeful and powerful in their simplicity Provide technical leadership for mobile architecture and design patterns, acting as a multiplier for your team's impact Mentor other engineers, fostering their growth …

Added Oct 27, 2026

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KLA

Mechanical Design Engineer

Yavné, Israel

Full time
Regular

… of own development tasks, delivery and quality. Hands-on (including assemblies and testing) as mechanics engineer of one of our cutting-edge products. Minimum Qualifications BSc in mechanical engineering At least 5 years …

Added Oct 15, 2026

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KLA

Mechanical Design Engineer

Newport, United Kingdom

Full time
Regular

… which is responsible for creating all of KLA's metrology and inspection products, is looking a Mechanical Design Engineer to join the team based in Newport, UK. Purpose of the role We are looking for a Mechanical Design …

Added Oct 15, 2026

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Capital One Financial

Mobile Engineer 4 (Android - Manager, IC)

McLean, Virginia, United States +1 location 2 postings

Added Oct 27, 2026

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Broadcom

Package Design Engineer

San Jose, California, United States +2 locations

Full time
Regular

Pay posted by employer$82,500–$132,000 USD per year

Broadcom is seeking an IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed …

Added Oct 5, 2026

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Broadcom

Package Design Engineer

San Jose, California, United States +2 locations

Full time
Regular

Pay posted by employer$101,000–$162,000 USD per year

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed …

Added Oct 5, 2026

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KLA

System Design Engineer

Milpitas, California, United States

Full time
Regular

Pay posted by employer$159,500–$233,967 per year

… Plasma) Division provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Rapid Division provides market-leading reticle inspection solutions for the semiconductor …

Added Oct 15, 2026

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Applied Materials

Senior Design Engineer

Singapore, Singapore

We are seeking an experienced Senior FEA Modeling Engineer to join the Advanced Packaging Modeling team. The engineer will independently lead complex …

Added Oct 27, 2026

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KLA

System Design Engineer

Singapore, Singapore

Full time
Regular

… devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection …

Added Oct 15, 2026

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Capital One Financial

Full-Stack Engineer 4 (Manager, IC)

New York City, New York, United States +1 location

… AWS tools and services Provide technical leadership and direction across Agile teams, setting standards for design, development, and operational excellence Partner with architects to define service boundaries, integration …

Added Oct 27, 2026

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Capital One Financial

Full-stack Engineer 4 (Manager IC)

Richmond, Virginia, United States +1 location

Added Oct 27, 2026

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Capital One Financial

Full-stack Engineer 4 (Manager IC)

Richmond, Virginia, United States +1 location 3 postings

Added Oct 27, 2026

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Capital One Financial

Full-stack Engineer 4 (Manager, IC)

Plano, Texas, United States

Added Oct 27, 2026

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Capital One Financial

Full-stack Engineer 4 (Manager, IC)

New York City, New York, United States +3 locations 2 postings

Added Oct 27, 2026

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KLA

System Design Engineer

Milpitas, California, United States

Full time
Regular

Pay posted by employer$136,300–$231,700 per year

Added Oct 15, 2026

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KLA

System Design Engineer

Milpitas, California, United States

Full time
Regular

Pay posted by employer$136,300–$231,700 per year

Added Oct 15, 2026

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Capital One Financial

Full-stack Engineer 4 (Manager, IC)

McLean, Virginia, United States 3 postings

Added Oct 29, 2026

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Capital One Financial

Full-stack Engineer 4 (Manager, IC)

Richmond, Virginia, United States 2 postings

Added Oct 27, 2026

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Capital One Financial

Full-stack Engineer 4 (Manager, IC)

New York City, New York, United States 2 postings

Added Oct 27, 2026

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Applied Materials

Senior Design Engineer

Singapore, Singapore

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About this opportunity

Original employer description

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Location:

Singapore,SGP

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

About the Role

We are seeking an experienced Senior FEA Modeling Engineer to join the Advanced Packaging Modeling team. The engineer will independently lead complex thermal-mechanical simulation projects that influence package architecture, material selection, process windows, qualification strategy, and reliability risk reduction. This role requires approximately five or more years of relevant industrial experience, strong technical judgment, and the ability to convert ambiguous cross-functional problems into validated modeling plans and actionable engineering recommendations.

Key Responsibilities

· Independently define, develop, validate, and deploy high-fidelity FEA models for advanced semiconductor package technologies.

· Lead thermo-mechanical reliability modeling to predict package performance and failure risks under manufacturing, qualification, and operating conditions, including thermal cycling, process-induced stress, fatigue, creep, delamination, and interfacial failure.

· Lead thermal-mechanical analyses of stress, strain, warpage, delamination risk, thermal cycling, creep, plasticity, viscoelasticity, and interfacial behavior across flip-chip, fan-out, 2.5D/3D IC, chiplet, TSV, HBM, and hybrid-bonded structures.

· Develop thermal and coupled multi-physics models to guide package design, material tradeoffs, process integration, and cooling concepts.

· Translate business and engineering questions into simulation requirements, model hierarchies, validation plans, and decision-ready outputs.

· Plan and execute sensitivity analyses, design-of-experiment studies, optimization, and uncertainty assessments to identify robust design and process windows.

· Correlate models with metrology, material characterization, reliability testing, and failure analysis; calibrate constitutive models and quantify predictive limitations.

· Provide clear recommendations to design, process, reliability, manufacturing, and customer-facing teams, including risk statements and proposed validation actions.

· Own simulation workflows and technical reviews for assigned projects, ensuring model quality, traceability, and timely delivery.

· Mentor junior engineers, establish modeling best practices, and drive automation, standardization, and reuse across the team.

· Support technology roadmaps and evaluate emerging materials, interconnects, processes, and package architectures from a thermo-mechanical reliability perspective.

Required Qualifications

· M.S. or Ph.D. in Mechanical Engineering, Materials Science, Applied Mechanics, Applied Physics, or a related field.

· At least five years of relevant industrial experience in thermal-mechanical FEA, preferably in semiconductor packaging, electronics, or an adjacent high-reliability technology domain.

· Demonstrated proficiency with ANSYS, Abaqus, COMSOL, or an equivalent commercial FEA platform, including nonlinear and temperature-dependent material modeling.

· Strong knowledge of advanced packaging architectures and processes, including die attach, underfill, molding, bumping, bonding, reflow, wafer-level processes, and package assembly.

· Practical understanding of polymers, metals, ceramics, interfaces, and their behavior under thermal and mechanical loading.

· Proven ability to validate models, diagnose numerical and physical issues, and communicate recommendations to both technical and leadership audiences.

· Ability to manage multiple priorities and work effectively across design, process integration, reliability, manufacturing, and external partner teams.

Preferred Qualifications

· Experience with coupled electro-thermal-mechanical, fracture, cohesive-zone, creep, viscoelastic, process-induced stress, or submodeling methodologies.

· Experience with HBM, hybrid bonding, FOWLP, chiplets, BSPDN, co-packaged optics, or other emerging integration technologies.

· Familiarity with JEDEC qualification methods and using simulation to interpret or improve reliability test outcomes.

· Advanced scripting and workflow automation using Python, MATLAB, APDL, TCL, or equivalent tools.

· Experience with optimization, surrogate modeling, uncertainty quantification, or tools such as optiSLang.

Demonstrated technical leadership through mentoring, methodology ownership, patents, publications, customer engagement, or cross-functional project leadership.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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