587 matching jobs for “Senior Chip Design Engineer”

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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.

Analog Devices

Staff DFT Engineer

Bengaluru, Karnataka, India

DFT Architecture & Planning Own DFT architecture definition at chip and subsystem level Define scan, compression, LBIST, MBIST, boundary scan, and test access strategies Drive …

Added Nov 3, 2026

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Nvidia

Formal Verification Engineer

China, Shanghai

The NVIDIA GPU clocks group is looking for excellent Senior Formal Verification engineers to join the team. The Team is responsible for crafting all aspects of GPU …

Added Oct 27, 2026

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Applied Materials

… Ireland / Grenoble, France). Within our Installation department, we are looking for our Installation Engineer to support European regions . The iTeam (Installation team) stands for the Installation of semiconductors …

Added Oct 27, 2026

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KLA

System Engineer

Westwood, MA

Full time
Regular

Pay posted by employer$150,500–$255,900 per year

… devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and …

Added Oct 15, 2026

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KLA

Product Development Engineer

Singapore, Singapore

Full time
Regular

Added Oct 15, 2026

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Cisco Systems

Silicon Photonics Packaging Product Engineer

Taipei, Taiwan, Taiwan

Responsible for taking Silicon Photonics wafer & chip level packaging and assembly product from NPI to HVM release with OSAT partner. Work in collaboration with …

Added Oct 27, 2026

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KLA

System Engineer

Hillsboro, Oregon, United States

Full time
Regular

Pay posted by employer$115,900–$197,000 per year

… a key part in advancing business priorities by delivering high-impact work across your area of expertise. Senior Systems Engineer We are looking for an experienced Systems Engineer to join our team! Our Systems Engineers …

Added Oct 15, 2026

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KLA

Product Development Engineer

Hsinchu, Taiwan, Taiwan

Full time
Regular

Added Oct 15, 2026

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KLA

Software Project Engineer

Yokohama, Kanagawa, Japan

Full time
Regular

… hard problems. There is never a dull moment with us. Group/Division Enabling the movement toward advanced chip design, KLA's Measurement, Analytics and Control group (MACH) is looking for the best and brightest …

Added Oct 15, 2026

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Applied Materials

Epitaxy Customer Engineer

Icheon-Gwango,KOR

… with customers to ensure smooth operations and exceptional service. Role Responsibilities: Collaborate with Senior Field Service Engineers [Customer Engineers] in installing, maintaining, and upgrading customer equipment …

Added Oct 27, 2026

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KLA

Product Development Engineer

Hsinchu, Taiwan, Taiwan

Full time
Regular

Added Oct 15, 2026

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KLA

Specialist, AI Engineer

Chennai, Tamil Nadu, India

Full time
Regular

Added Oct 15, 2026

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KLA

Applications Development Engineer

Hsinchu, Taiwan, Taiwan

Full time
Regular

Added Oct 15, 2026

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KLA

HPC Storage Engineer

Ann Arbor, Michigan, United States

Full time
Regular

Pay posted by employer$105,900–$155,300 per year

… a key part in advancing business priorities by delivering high-impact work across your area of expertise. Design, test, and tune storage systems that power real HPC workloads! The Computational Solutions Infrastructure …

Added Oct 15, 2026

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Applied Materials

Industrial Engineer

Kalispell, Montana, United States

Pay posted by employer$78,500–$108,000

The Industrial Engineer II is responsible for improving manufacturing systems, material flow, capacity utilization, facility …

Added Oct 27, 2026

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Nvidia

Senior Product Architect

Santa Clara, California, United States

… to amplify human creativity and intelligence. NVIDIA is looking for a Product Architect to help define & design SoC- and GPU-based products and drive hardware/software feature improvements through collaboration with the …

Added Oct 27, 2026

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Applied Materials

Systems Engineer IV

Gloucester, Massachusetts, United States

Pay posted by employer$140,000–$192,500

… materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI …

Added Oct 27, 2026

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KLA

HPC Systems Engineer

Singapore, Singapore

Full time
Regular

Added Oct 15, 2026

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Applied Materials

Senior Java Developer

Reẖovot, Central District, Israel

Added Oct 27, 2026

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KLA

Product Engineer

Ann Arbor, Michigan, United States

Full time
Regular

Pay posted by employer$76,300–$111,900 per year

… business priorities by delivering high-impact work across your area of expertise. KLA is seeking a Product Engineer to support wafer inspection tools in the Central Engineering Group in Ann Arbor. This role is responsible …

Added Oct 15, 2026

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Cisco Systems

Silicon Photonics Packaging Product Engineer

Taipei, Taiwan, Taiwan

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Minimum Qualifications · employer excerpt

MS minimum/PhD preferred degree in Electrical Engineering, physics or material science or equivalent educational background
5+ years of hands-on experience in chip on wafer (CoW) and CoC (Chip on Chip) wafer processing and assembly processes resulting in quantifiable improvements in quality, yield, & cost.
Proven track record of transitioning products from NPI to High volume production at OSAT suppliers
Strong knowledge of various wafer processing and flip chip assembly equipment
Experience with design for manufacturability (DFM) during early product development.

2 more in the full description below.

About this opportunity

Original employer description

Meet the Team

Optics Operations Product Engineering team partners with cross-functional team of development engineers to design and sustain Optical transceiver components and modules throughout their product lifecycle. Product Engineers are self-motivated, result oriented, and strong-minded engineers who embrace creativity and new ways of thinking to deliver innovative solutions.

Your Impact

Optics Operations is an organization that enables and accelerates innovation to create an unrivaled customer experience & competitive advantage for Cisco through end-to-end operation leadership and product lifecycle management. In this role, you will be a key Optics Operations Engineering team member supporting the Cisco Optics Operations next generation product portfolio.

Role & Responsibilities:

Responsible for taking Silicon Photonics wafer & chip level packaging and assembly product from NPI to HVM release with OSAT partner.
Work in collaboration with Engineering and Technology & Quality teams to set SYL/SBL & other statistical methods to characterize and optimize qualified optical packaging assembly processes, make decisions on innovative changes to improve yields and product quality
Work in collaboration with Technology & Quality team to support new OSAT supplier engagement and introduction of new optical packaging product technology
Drive the characterization of NPI product performances and yield including benchmark correlation to meet and/or exceed product cost targets
Work in collaboration with Engineering and Technology & Quality teams to drive DFx for optical packaging design and assembly.
Responsible for reviewing and monitoring ETest/WAT data to proactively drive resolution to critical yield issues
Work in collaboration with Design team & Test Engineering to stabilize and improve product screening at wafer-probe and package levels.

Minimum Qualifications:

MS minimum/PhD preferred degree in Electrical Engineering, physics or material science or equivalent educational background
5+ years of hands-on experience in chip on wafer (CoW) and CoC (Chip on Chip) wafer processing and assembly processes resulting in quantifiable improvements in quality, yield, & cost.
Proven track record of transitioning products from NPI to High volume production at OSAT suppliers
Strong knowledge of various wafer processing and flip chip assembly equipment
Experience with design for manufacturability (DFM) during early product development.
Strong Analytical skills & experience with troubleshooting and JMP scripting, Python, or AI models for automated yield prediction and monitoring
Strong written, verbal, and interpersonal skills with experience presenting to senior level leadership.

Desired Skills:

Solid understanding of manufacturing process, related to semiconductor assembly and optical module manufacturing
Experience with Cu micro bump processing and flip chip assemblies and TSV technologies
Knowledge of post CMOS back end assembly and packaging process technologies

Why Cisco?

At Cisco, we’re revolutionizing how data and infrastructure connect and protect organizations in the AI era – and beyond. We’ve been innovating fearlessly for 40 years to create solutions that power how humans and technology work together across the physical and digital worlds. These solutions provide customers with unparalleled security, visibility, and insights across the entire digital footprint.

Fueled by the depth and breadth of our technology, we experiment and create meaningful solutions. Add to that our worldwide network of doers and experts, and you’ll see that the opportunities to grow and build are limitless. We work as a team, collaborating with empathy to make really big things happen on a global scale. Because our solutions are everywhere, our impact is everywhere.

We are Cisco, and our power starts with you.

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