Searching jobs…
Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.
US, Oregon, Hillsboro
Pay posted by employer$133,800–$219,550 USD per year
The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting …
US-MA-ANDOVER-AR1 ~ 358 Lowell St ~ AR1 DUKES BLDG
An exciting opportunity exists for an experienced Principal RF Module Design/Development Engineer to join our Module Development Section within the RF Microelectronics/Module …
US-MA-ANDOVER-AR1 ~ 358 Lowell St ~ AR1 DUKES BLDG
An exciting opportunity exists for an experienced Senior RF Module Design/Development Engineer to join our Module Development Section within the RF Microelectronics/Module …
Malaysia, Penang
… sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
… strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class …
Malaysia, Kulim
… essential job responsibilities. Develops assembly processes and/or equipment for CUF (capillary underfill) module and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging …
US, New Mexico, Albuquerque
Pay posted by employer$103,730–$146,440 USD per year
The Role and Impact New Mexico is Intel's flagship high-volume Advanced Packaging manufacturing site, providing full co-location of the Advanced Packaging line at a single site, with New …
US, Oregon, Hillsboro
Pay posted by employer$211,400–$298,440 USD per year
As a Principal Engineer for Die-to-Wafer Hybrid Bonding (HBI) module, you will play a pivotal role in defining and scaling …
Santa Clara, California, United States
Pay posted by employer$147,000–$202,500
… and care for you at work, at home, or wherever you may go. Learn more about our benefits . As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and …
US, Arizona, Phoenix
Pay posted by employer$85,200–$162,500 USD per year
… and ready to make a real impact from day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts. In this role, you will be at the forefront of …
India, Bangalore 2 postings
Define packaging solutions for highly innovative integrated circuits, meeting adequate mechanical, thermal and electrical …
US, New Mexico, Albuquerque
Pay posted by employer$103,730–$146,440 USD per year
… essential job responsibilities. The Role and Impact New Mexico is Intel's flagship high-volume Advanced Packaging manufacturing site, providing full co-location of the Advanced Packaging line at a single site, with New …
Vietnam, Ho_Chi_Minh_City
The Role and Impact As a Module Engineer, you will be at the forefront of managing and optimizing high-volume manufacturing equipment and …
Taipei, Taiwan
Responsible for taking Silicon Photonics wafer & chip level packaging and assembly product from NPI to HVM release with OSAT partner. Work in collaboration with Engineering and …
US, Oregon, Hillsboro
Pay posted by employer$115,110–$219,550 USD per year
The Advanced Packaging Technology Development (APTD) Metrology Group at Intel sits at the heart of our most critical technology …
Malaysia, Kulim
The Role and Impact As a Process and Equipment Engineer specializing in Pick and Place, PnP technology, you will be the technical owner driving the performance, …
Santa Clara, California, United States
Pay posted by employer$124,000–$171,000
Applied Materials is seeking a Global Product Support (GPS) Engineer( Capital Equipment Hardware engineer ) to support installation, startup, qualification, and ongoing …
US, Arizona, Phoenix
Pay posted by employer$99,030–$139,810 USD per year
… Intel offers engineers the opportunity to do the most meaningful work of their careers. Intel's Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge …
US, Arizona, Phoenix
Pay posted by employer$85,200–$139,810 USD per year
… Intel offers engineers the opportunity to do the most meaningful work of their careers. Intel's Substrate Packaging Technology Development (SPTD) organization is on a mission to be the supplier of choice for leading-edge …
US, Arizona, Phoenix
Pay posted by employer$85,200–$162,500 USD per year
… leading semiconductor companies, driving innovation that shapes the future of technology. Our Substrate Packaging Technology Development (SPTD) organization is at the forefront of advanced packaging solutions, with a …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
