Packaging Module Development Engineer · AnywhereEdit
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112 matching jobs for “Packaging Module Development Engineer”

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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.

Intel

Module Engineer On-Shift (MEOS) – Day Shift (5)

US, Arizona, Phoenix

Pay posted by employer$99,030–$139,810 USD per year

… leading semiconductor companies, driving innovation that shapes the future of technology. Our Substrate Packaging Technology Development (SPTD) organization is at the forefront of advanced packaging solutions, with a …

Added Oct 27, 2026

Intel

ATD Laser Development Engineer

US, Arizona, Phoenix

Pay posted by employer$85,200–$162,500 USD per year

The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. …

Added Oct 27, 2026

Intel

LTD Product Development Engineer

US, Oregon, Hillsboro

Pay posted by employer$141,910–$200,340 USD per year

… customers' needs with precision. Life at Intel: https://jobs.intel.com/en/life-at-intel As an LTD Product Development Engineer, you will play a pivotal role in advancing our technology. This position involves developing and …

Added Oct 27, 2026

Intel

Semiconductor Packaging Integration Research Manager

US, Arizona, Phoenix +1 location

Pay posted by employer$220,920–$311,890 USD per year

… manufacturing. The team conducts advanced research in devices, materials, interconnects, patterning, packaging, heterogeneous integration, and system technologies, while partnering closely with technology development, …

Added Oct 27, 2026

Intel

Module Engineering - Day Shift 5 or 7

US, Arizona, Phoenix

Pay posted by employer$85,200–$162,500 USD per year

… Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer, you will develop and optimize assembly processes and equipment, applying innovative …

Added Oct 27, 2026

Intel

Module Engineering - Day Shift 5 or 7

US, Arizona, Phoenix

Pay posted by employer$99,030–$139,810 USD per year

… planet. Intel's Foundry Technology Manufacturing business unit is at the forefront of delivering advanced packaging solutions for a broad ecosystem of global customers. We collaborate with world-class engineers, contribute …

Added Oct 27, 2026

KLA

Regional Development Applications Engineer (SPTS)

Hsinchu, Taiwan +4 locations

  • Full time
  • Regular

… related to PVD semiconductor thin film technology. This will involve working on several different process module types and a huge range of applications at multiple customer sites, collecting data, investigating problems …

Added Oct 15, 2026

KLA

Regional Development Applications Engineer (SPTS)

Hsinchu, Taiwan +4 locations

  • Full time
  • Regular

… related to PVD semiconductor thin film technology. This will involve working on several different process module types and a huge range of applications at multiple customer sites, collecting data, investigating problems …

Added Oct 15, 2026

HP

India Development Centre (IDC)

Bengaluru, India

  • Full time
  • Reg Employee

… building the future of personal computing — bold, inclusive, and driven by innovation. As part of our India Development Center, you’ll be at the forefront of creating products and solutions that cater to diverse consumer needs …

Added Oct 12, 2026

Intel

3DIC Platform Wet and Plating Development Manager

US, Oregon, Hillsboro

Pay posted by employer$180,770–$255,200 USD per year

Intel Foundry is seeking an exceptional Wet and Plating Module Development Manager to lead our Wet Etch/Clean as well as Plating technology development for 3DIC platform. …

Added Oct 27, 2026

Broadcom

R&D Engineer

San Jose, California, United States

  • Full time
  • Regular

Pay posted by employer$167,500–$268,000 per year

The ideal candidate will have expertise in advanced packaging technology, and ‘system in package’ assembly, including manufacturability and reliability issues with …

Added Oct 5, 2026

KLA

System Design Engineer

Milpitas, California, United States

  • Full time
  • Regular

Pay posted by employer$136,300–$231,700 per year

… us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing …

Added Oct 15, 2026

KLA

System Design Engineer

Milpitas, California, United States

  • Full time
  • Regular

Pay posted by employer$136,300–$231,700 per year

… us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing …

Added Oct 15, 2026

Applied Materials

Process Integration Engineer

Albany, New York, United States +1 location

Pay posted by employer$108,000–$148,500

… and care for you at work, at home, or wherever you may go. Learn more about our benefits . As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and …

Added Oct 27, 2026

Location reference: GeoNames (CC BY 4.0), normalized by Referizz.

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