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Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.
Hillsboro, Oregon, United States
Pay posted by employer$155,520–$219,550 USD per year
The Role and Impact As a Module Development Engineer within Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you …
Kulim, Kedah, Malaysia
… solutions in circuit board technology, assembly processes, and materials. In this role, you will be a Packaging Module Development Engineer focuses on process, equipment, materials technology development for SMT processes and Printed Circuit …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
The Packaging Module Development Engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
… Are you ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology & Manufacturing (APTM) team in Chandler, Arizona . In this role, …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
… innovative package assembly solutions and scales them for high-volume manufacturing. We are seeking a Packaging Module Development Engineer to join our campus in Chandler, Arizona. In this role, you will contribute to advancing technology and …
Kulim, Kedah, Malaysia
Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM …
Phoenix, Arizona, United States
Pay posted by employer$85,200–$139,810 USD per year
At Intel, we create world-changing technology that improves the life of every person on the planet. Intel's Packaging Module Development team is dedicated to designing and optimizing cutting-edge assembly and packaging …
Phoenix, Arizona, United States
Pay posted by employer$99,030–$188,890 USD per year
… a pivotal role in pioneering assembly packaging technologies that drive Intel's future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment to enable next-generation packaging solutions …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
… Intel's broader goals of technological leadership and global customer success. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in developing and …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$255,200 USD per year
… shapes the future of computing, connectivity, and human progress. With decades of pioneering research and development, Intel is at the forefront of designing and manufacturing the world's most advanced chips and technologies. …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$255,200 USD per year
The Role and Impact As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing …
Phoenix, Arizona, United States
Pay posted by employer$133,800–$188,890 USD per year
The Role and Impact As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to …
Phoenix, Arizona, United States
Pay posted by employer$99,030–$188,890 USD per year
… an inclusive workplace where diverse perspectives fuel creativity and drive meaningful impact. Intel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our …
Hillsboro, Oregon, United States
Pay posted by employer$155,520–$219,550 USD per year
As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor …
Phoenix, Arizona, United States
Pay posted by employer$115,110–$219,550 USD per year
… Note: This role requires regular onsite presence to fulfill essential job responsibilities. As an RF Module Development Engineer, you will be at the forefront of driving innovation and quality in analog and RF test. …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$219,550 USD per year
The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting …
US-MA-ANDOVER-AR1 ~ 358 Lowell St ~ AR1 DUKES BLDG
An exciting opportunity exists for an experienced Principal RF Module Design/Development Engineer to join our Module Development Section within the RF Microelectronics/Module …
US-MA-ANDOVER-AR1 ~ 358 Lowell St ~ AR1 DUKES BLDG
An exciting opportunity exists for an experienced Senior RF Module Design/Development Engineer to join our Module Development Section within the RF Microelectronics/Module …
Malaysia, Penang
… sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance …
Hillsboro, Oregon, United States
Pay posted by employer$133,800–$255,200 USD per year
… strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
