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US, Oregon, Hillsboro
Pay posted by employer$155,520–$219,550 USD per year
The Role and Impact As a Module Development Engineer within Intel's Advanced Packaging Technology Development (APTD) Metrology Group, you …
Malaysia, Kulim
… solutions in circuit board technology, assembly processes, and materials. In this role, you will be a Packaging Module Development Engineer focuses on process, equipment, materials technology development for SMT processes and Printed Circuit …
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
The Packaging Module Development Engineer develops assembly processes and/or equipment and applies novel concepts for innovative solutions to enable …
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Module Development Engineer to join our Arizona-based team. In this role, you will be at the forefront of developing cutting-edge …
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
… Are you ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology & Manufacturing (APTM) team in Chandler, Arizona . In this role, …
US, Oregon, Hillsboro
Pay posted by employer$115,110–$219,550 USD per year
We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across …
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
… innovative package assembly solutions and scales them for high-volume manufacturing. We are seeking a Packaging Module Development Engineer to join our campus in Chandler, Arizona. In this role, you will contribute to advancing technology and …
US, Arizona, Phoenix
Pay posted by employer$115,110–$219,550 USD per year
… that support Intel's technology leadership in high-performance computing applications. We are seeking a Packaging Module Development Engineer to join our team in Chandler, Arizona. This unique hybrid position sits at the intersection of metrology …
Malaysia, Kulim
Process Development Engineer Role in Solder Ball Attach or Chip Attach Process in Technology Development Organization. CAM/SLAM …
US, Arizona, Phoenix
Pay posted by employer$115,110–$219,550 USD per year
The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process …
US, Arizona, Phoenix
Pay posted by employer$85,200–$139,810 USD per year
At Intel, we create world-changing technology that improves the life of every person on the planet. Intel's Packaging Module Development team is dedicated to designing and optimizing cutting-edge assembly and packaging …
US, Arizona, Phoenix
Pay posted by employer$99,030–$188,890 USD per year
… a pivotal role in pioneering assembly packaging technologies that drive Intel's future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment to enable next-generation packaging solutions …
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
… Intel's broader goals of technological leadership and global customer success. We are seeking a Senior Packaging Module Development Engineer to join our team in Chandler, Arizona. In this role, you will play a critical part in developing and …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
… shapes the future of computing, connectivity, and human progress. With decades of pioneering research and development, Intel is at the forefront of designing and manufacturing the world's most advanced chips and technologies. …
US, Oregon, Hillsboro
Pay posted by employer$133,800–$255,200 USD per year
The Role and Impact As a Module Development Engineer, you will play an integral role in advancing Intel's semiconductor manufacturing …
US, Oregon, Hillsboro
Pay posted by employer$89,010–$125,660 USD per year
… technology that improves the life of every person on the planet. By joining the Oregon Advanced Packaging (ORAP) team—supporting both our Aloha and Ronler factories—you will become part of the Wafer Packaging …
US, Arizona, Phoenix
Pay posted by employer$133,800–$188,890 USD per year
The Role and Impact As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to …
US, Arizona, Phoenix
Pay posted by employer$99,030–$188,890 USD per year
… an inclusive workplace where diverse perspectives fuel creativity and drive meaningful impact. Intel's Packaging Module Development team is seeking a talented and driven Packaging Process Development Engineer to join our …
US, Oregon, Hillsboro
Pay posted by employer$155,520–$219,550 USD per year
As a Module Development Engineer, you will play an essential role in driving advancements in semiconductor …
US, Arizona, Phoenix
Pay posted by employer$115,110–$219,550 USD per year
… Note: This role requires regular onsite presence to fulfill essential job responsibilities. As an RF Module Development Engineer, you will be at the forefront of driving innovation and quality in analog and RF test. …
Location reference: GeoNames (CC BY 4.0), normalized by Referizz.
