Exact titles rank first, then title variations and keywords in descriptions. These labels aren't qualification scores. Without keywords, recently added jobs appear first.
Pay posted by employer$120,860–$231,670 USD per year
… of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the …
Pay posted by employer$76,390–$146,440 USD per year
… of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the …
Job Title: Graduate Process / Equipment Engineer Intel Ireland is a leading centre for semiconductor manufacturing and technology development, producing …
Job Description Role and Impact Join Intel Wafer Packaging Manufacturing WPM C4 Ireland as a Module Engineer, and play a key role in advancing one of Intel most important manufacturing operations. Wafer Packaging …
… sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance …
… technology. At Intel Ireland, we're not just building semiconductor chips, we're building the future. As a Module Engineering Intern, you'll join a team of passionate engineers working on Intel's most advanced process …
Pay posted by employer$133,800–$188,890 USD per year
… become increasingly rigorous. The role of a Chemical Mechanical Planarization (CMP) Process Development Engineer in LTD encompasses developing and sustaining planarization techniques for a variety of materials and …
… in circuit board technology, assembly processes, and materials. In this role, you will be a Packaging Module Development Engineer focuses on process, equipment, materials technology development for SMT processes and …
Pay posted by employer$133,800–$188,890 USD per year
… ready to shape the future of semiconductor technology? We're looking for a talented and driven Packaging Module Development Engineer to join our Advanced Packaging Technology & Manufacturing (APTM) team in Chandler, …
Pay posted by employer$133,800–$188,890 USD per year
… package assembly solutions and scales them for high-volume manufacturing. We are seeking a Packaging Module Development Engineer to join our campus in Chandler, Arizona. In this role, you will contribute to …
Pay posted by employer$115,110–$219,550 USD per year
… Intel's technology leadership in high-performance computing applications. We are seeking a Packaging Module Development Engineer to join our team in Chandler, Arizona. This unique hybrid position sits at the …
Pay posted by employer$115,110–$219,550 USD per year
… Chemistry, Mechanical Engineering, or a related discipline. 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization. Preferred Qualifications: Experience in …
