1,000+ matching jobs for “Process Engineer”

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Applied Materials

Process Integrator Advanced Packaging & Co-Packaged Optics R&D

Albany, New York, United States +1 location

Pay posted by employer$176,000–$242,000

We are seeking an experienced Process Integrator to lead development and integration of advanced semiconductor packaging modules in an R&D …

Added Oct 27, 2026

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Amgen

Process Development Senior Scientist - Pre-Pivotal Drug Product Technologies

Thousand Oaks, California, United States

… as part of the Amgen team. Join us and transform the lives of patients while transforming your career. Process Development Sr Scientist What you will do Let’s do this. Let’s change the world. In this vital role you …

Added Oct 31, 2026

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Micron Technology

Senior Member of Technical Staff (SMTS) – Process Development, CMP, NAND

Fab 10N/X, Singapore

Own and lead key NAND CMP process modules, translating technology challenges into executable roadmaps across current and future nodes Drive …

Added Nov 3, 2026

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Micron Technology

Distinguished Member of Technical Staff (DMTS) – Process Development, Photolithography, NAND

Fab 10N/X, Singapore

… Engineering, Physics, or related field, with demonstrated experience in semiconductor photolithography process development. Industry recognized innovation leader Must ‑ Have Technical Skills Advanced proficiency in …

Added Nov 3, 2026

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Micron Technology

Senior Member of Technical Staff (SMTS) – Process Development, Photolithography, NAND

Fab 10N/X, Singapore

… future nodes and architectures Establish long-term technology vision, defining long ‑ term photolithography process and equipment technology roadmaps. De ‑ risk novel lithography concepts and platforms. Serve as a technical …

Added Nov 3, 2026

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Procter & Gamble

PC&IS Automation Technician (Process Control & Industrial Systems) - Mechelen Plant

Mechelen, Flanders, Belgium

… will receive encouraging functional and corporate trainings and mentoring to facilitate Your on-boarding process. You’ll expand your knowledge based on personal experiences with industry experts and great managers who …

Added Oct 27, 2026

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Micron Technology

Member of Technical Staff (MTS) – Process Development, Cell Film, NAND

Fab 10N/X, Singapore

Lead project-level initiatives for cell film process development; execute complex experiments and integration support under senior guidance. Maintain thorough …

Added Nov 3, 2026

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Micron Technology

Distinguished Member of Technical Staff (DMTS) – Process Development, CMP, NAND

Fab 10N/X, Singapore

… development, defining long‑term technology and equipment strategies Architect and drive next‑generation CMP process innovation, including FOAK developments, recipe architecture, and integration alignment Lead resolution of …

Added Nov 3, 2026

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USAA

Business Process Owner 1 (Mid-Level)– Life Claims Experience Team

San Antonio Home Office I

Full time
Regular

Pay posted by employer$77,120–$138,810

will include defining process objectives, business rules, and performance requirements, and managing the end-to-end interactions between …

Added Oct 27, 2026

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Applied Materials

College Intern - Process development in PVD Ventura chambers for TSV application

Singapore, Singapore

… growth and care for you at work, at home, or wherever you may go. Learn more about our benefits . 1. With engineer’s guidance to perform, collect data and analyze on unusually complex experiments to develop the physical …

Added Oct 28, 2026

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Micron Technology

Senior Member of Technical Staff (SMTS) – Process Development, Cell Film, NAND

Fab 10N/X, Singapore

Define technical strategy; architect solutions; influence technical standards and drive process improvements; lead advanced process development, fixing, and integration. Integrate unit processes into …

Added Nov 3, 2026

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Micron Technology

Member of Technical Staff (MTS) – Process Development, Dry Etch, NAND

Fab 10N/X, Singapore

… gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact [email protected] Micron Prohibits the use of …

Added Nov 3, 2026

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Micron Technology

Senior Member of Technical Staff (SMTS) – Process Development, Dry Etch, NAND

Fab 10N/X, Singapore

… and technical mentorship across the dry etch organization. Main Responsibilities Own key dry etch process levels/modules and translate technology challenges into executable roadmaps across multiple nodes. Lead …

Added Nov 3, 2026

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Micron Technology

Distinguished Member of Technical Staff (DMTS) – Process Development, Dry Etch, NAND

Fab 10N/X, Singapore

Act as technical expert for dry etch process, hardware, and applications in NAND technology development; provide forward-looking insight on trends, …

Added Nov 3, 2026

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Micron Technology

Distinguished Member of Technical Staff (DMTS) – Process Development, Cell Film, NAND

Fab 10N/X, Singapore

… in Diffusion, CVD, and Cell Film technologies Proven track record of architecting technical solutions & process-device correlation Publications/patents and strong record of technical contributions. Must-Have Technical …

Added Nov 3, 2026

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Micron Technology

Member of Technical Staff (MTS) – Process Development, Thin Films (CVD/Diffusion), NAND

Fab 10N/X, Singapore

… Support technology transfer and ramp-up activities; participate in multi-functional problem- solving for process challenges and innovation. Maintain thorough records and prepare comprehensive technical reports; …

Added Nov 3, 2026

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Applied Materials

College intern - Process development in degas, preclean, PVD chambers for RLD/Bump application

Singapore, Singapore

Added Oct 27, 2026

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American Electric Power

Engineer Assc- Engineer ( Station Engineer)

New Albany, OH

Full time
Regular

Pay posted by employer$74,551–$109,543

… of their individual organizational unit. Demonstrates an understanding of the budgeting and approval process. Is proficient in the application and use of economic analysis techniques in problem solving. Develops an …

Added Oct 28, 2026

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Otis Worldwide

Senior Internal Controls & Process Improvement Specialist BeLux (EN & NL &/or FR)

Spoorwegstraat 34, 1702 Groot-Bijgaarden, Belgium

Added Oct 27, 2026

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IQVIA Holdings

Staff Software Developer Engineer

Warsaw, Poland

… Grafana, or Azure Monitor. Experience with PostgreSQL, Oracle, Hive, HDFS, or Impala. Azure Data Engineer, Azure Developer, Azure DevOps, or related cloud certifications. Familiarity with AI Agent IDE tools (e.g. …

Added Oct 15, 2026

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Applied Materials

Process Integrator Advanced Packaging & Co-Packaged Optics R&D

Albany, New York, United States +1 more

Pay posted by employer$176,000–$242,000

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Required Qualifications · employer excerpt

MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Applied Physics, Photonics, or a related technical field.

About this opportunity

Original employer description

Who We Are

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

What We Offer

Salary:

$176,000.00 - $242,000.00

Location:

Albany,NY, Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Advanced Packaging & Co-Packaged Optics R&D

Albany, New York

Position Summary

We are seeking an experienced Process Integrator to lead development and integration of advanced semiconductor packaging modules in an R&D environment. This role will connect unit processes, materials, device requirements, metrology, reliability, and equipment capabilities into robust integrated flows. The successful candidate will work across Applied Materials business units, external partners, and customers to convert complex technical objectives into executable integration plans, learning cycles, and differentiated solutions. Experience in co-packaged optics (CPO), photonics packaging, or optical/electrical heterogeneous integration is strongly preferred.

Key Responsibilities

Own end-to-end process integration for advanced packaging and heterogeneous integration programs, from initial concept and architecture through demonstration and technology transfer.

Develop integrated process flows for photonic integrated circuits, electronic ICs, optical engines, interposers, substrates, and fiber interfaces, including module sequences, process windows, control plans, and learning-cycle strategies.

Translate optical, electrical, thermal, mechanical, reliability, and manufacturability requirements into process-integration specifications and measurable success criteria for CPO modules.

Lead cross-functional execution across photonics, device, packaging, bonding, lithography, deposition, etch, clean, CMP, plating, metrology, optical test, electrical test, failure analysis, modeling, and reliability teams.

Drive integration of photonic and electronic die, including die-to-wafer or wafer-to-wafer bonding, fine-pitch interconnects, optical coupling and alignment, fiber attach interfaces, and advanced substrate or interposer integration.

Design and execute structured experiments and DOEs to optimize optical loss, coupling efficiency, alignment tolerance, interconnect performance, thermal behavior, defectivity, yield, and reliability.

Integrate laser, modulator, detector, waveguide, electronic IC, thermal-management, and package-level requirements into stable module and full-flow performance.

Identify and resolve CPO integration risks such as contamination, bonding defects, overlay and alignment error, warpage, thermal-mechanical stress, optical-interface degradation, and process-induced device shifts.

Create CPO technology roadmaps, integration reviews, risk assessments, schedules, and executive-ready reports; communicate clearly with engineers, senior leaders, customers, research partners, and suppliers.

Identify invention opportunities, contribute to intellectual property, and establish disciplined R&D practices for CPO integration, data quality, documentation, and technical decision-making.

Leadership Profile for E6

Recognized technical authority who applies broad integration expertise to solve unique and complex problems.

Leads programs with significant technical risk and organizational complexity; defines strategy and influences execution across functions.

Anticipates objections, aligns stakeholders, and persuades senior technical and business leaders using data and sound engineering judgment.

Balances deep technical ownership with practical program execution, customer impact, and development of others.

Work Location & Travel

Location: Albany, New York. This is an on-site R&D role requiring close collaboration with laboratory, fab, metrology, and integration teams.

Travel: Periodic domestic and international travel may be required to support customers, partners, and cross-site teams.

Required Qualifications

MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Applied Physics, Photonics, or a related technical field.

5–10 years of experience in a semiconductor process integrator or process-integration role, with substantial experience in R&D or advanced technology development.

Demonstrated experience building and executing integrated semiconductor or photonics process flows involving multiple process modules and cross-functional engineering teams.

Strong understanding of CPO, silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.

Working knowledge of photonic and electronic die integration, optical coupling and alignment, fiber attach interfaces, fine-pitch interconnects, and advanced substrate or interposer integration.

Understanding of optical loss, alignment tolerances, thermal management, thermal-mechanical interactions, packaging-induced stress, defect mechanisms, metrology, characterization, and reliability.

Experience planning experiments, applying statistical analysis and DOE methods, interpreting optical, electrical, physical, and reliability datasets, and converting results into clear technical decisions.

Proven ability to lead technically complex R&D projects with ambiguity, risk, and interdependencies while maintaining execution discipline.

Self-directed, collaborative, and comfortable working in a fast-paced global R&D organization.

Excellent written and verbal communication skills, including the ability to explain complex CPO integration issues to diverse technical and executive audiences.

Preferred Qualifications

Direct experience with co-packaged optics (CPO), silicon photonics, photonic integrated circuits, optical engines, or optical/electrical heterogeneous integration.

Experience with advanced packaging technologies such as 2.5D/3D integration, hybrid or fusion bonding, die-to-wafer or wafer-to-wafer integration, TSVs, fine-pitch interconnects, chiplets, advanced substrates, interposers, or wafer-level packaging.

Knowledge of optical alignment, coupling, packaging tolerances, optical loss, thermal-mechanical interactions, or photonics test and characterization.

Experience interfacing with customers, research consortia, universities, suppliers, or ecosystem partners on emerging technology programs.

A record of patents, publications, invited presentations, or technical leadership in semiconductor integration, advanced packaging, or photonics.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at [email protected], or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

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